JPH0193722U - - Google Patents
Info
- Publication number
- JPH0193722U JPH0193722U JP18875987U JP18875987U JPH0193722U JP H0193722 U JPH0193722 U JP H0193722U JP 18875987 U JP18875987 U JP 18875987U JP 18875987 U JP18875987 U JP 18875987U JP H0193722 U JPH0193722 U JP H0193722U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- groove
- periphery
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の半導体素子を搭載した樹脂封
止型半導体装置の断面図、第２図は本考案の半導
体素子の斜視図である。 １……半導体素子、２……溝、３……リードフ
レーム、４……封止樹脂。
止型半導体装置の断面図、第２図は本考案の半導
体素子の斜視図である。 １……半導体素子、２……溝、３……リードフ
レーム、４……封止樹脂。
Claims (1)
- 樹脂封止型半導体装置において、半導体素子表
面の素子周辺部に少なくとも一つ以上の溝がもう
けられている事を特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18875987U JPH0193722U (ja) | 1987-12-11 | 1987-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18875987U JPH0193722U (ja) | 1987-12-11 | 1987-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193722U true JPH0193722U (ja) | 1989-06-20 |
Family
ID=31479832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18875987U Pending JPH0193722U (ja) | 1987-12-11 | 1987-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193722U (ja) |
-
1987
- 1987-12-11 JP JP18875987U patent/JPH0193722U/ja active Pending