JPH02131355U - - Google Patents
Info
- Publication number
- JPH02131355U JPH02131355U JP4082589U JP4082589U JPH02131355U JP H02131355 U JPH02131355 U JP H02131355U JP 4082589 U JP4082589 U JP 4082589U JP 4082589 U JP4082589 U JP 4082589U JP H02131355 U JPH02131355 U JP H02131355U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- lead frame
- sealed semiconductor
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の樹脂封止型半導体装置の実施
例における縦断面図、第２図は従来の樹脂封止型
半導体装置の縦断面図である。 １……パツケージ部分、２……リードフレーム
。
例における縦断面図、第２図は従来の樹脂封止型
半導体装置の縦断面図である。 １……パツケージ部分、２……リードフレーム
。
Claims (1)
- リードフレーム表面に赤外線吸収コーテイング
処理を施した樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4082589U JPH02131355U (ja) | 1989-04-05 | 1989-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4082589U JPH02131355U (ja) | 1989-04-05 | 1989-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02131355U true JPH02131355U (ja) | 1990-10-31 |
Family
ID=31550951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4082589U Pending JPH02131355U (ja) | 1989-04-05 | 1989-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02131355U (ja) |
-
1989
- 1989-04-05 JP JP4082589U patent/JPH02131355U/ja active Pending