JPH03101539U - - Google Patents
Info
- Publication number
- JPH03101539U JPH03101539U JP924290U JP924290U JPH03101539U JP H03101539 U JPH03101539 U JP H03101539U JP 924290 U JP924290 U JP 924290U JP 924290 U JP924290 U JP 924290U JP H03101539 U JPH03101539 U JP H03101539U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- semiconductor device
- metal cap
- tin plating
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案の一実施例による半導体装置の
封止工程に関する展開斜視図、第２図は第１図の
金属キヤツプの断面図、第３図は本考案の他の実
施例を示す金属キヤツプの断面図、第４図は従来
の半導体装置の封止工程に関する展開斜視図であ
る。 図において、１……金属キヤツプ、１ａ……金
めつき層、１ｂ……錫めつき層、３……パツケー
ジ本体を示す。なお、図中、同一符号は同一、又
は相当部分を示す。
封止工程に関する展開斜視図、第２図は第１図の
金属キヤツプの断面図、第３図は本考案の他の実
施例を示す金属キヤツプの断面図、第４図は従来
の半導体装置の封止工程に関する展開斜視図であ
る。 図において、１……金属キヤツプ、１ａ……金
めつき層、１ｂ……錫めつき層、３……パツケー
ジ本体を示す。なお、図中、同一符号は同一、又
は相当部分を示す。
Claims (1)
- 金めつきした金属キヤツプの片面もしくは片面
の周囲に更に錫めつきをしたことを特徴とする半
導体装置用キヤツプ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP924290U JPH03101539U (ja) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP924290U JPH03101539U (ja) | 1990-01-31 | 1990-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101539U true JPH03101539U (ja) | 1991-10-23 |
Family
ID=31512848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP924290U Pending JPH03101539U (ja) | 1990-01-31 | 1990-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101539U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002359312A (ja) * | 2001-05-31 | 2002-12-13 | Kinseki Ltd | 電子部品容器 |
-
1990
- 1990-01-31 JP JP924290U patent/JPH03101539U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002359312A (ja) * | 2001-05-31 | 2002-12-13 | Kinseki Ltd | 電子部品容器 |