JPS6424848U - - Google Patents
Info
- Publication number
- JPS6424848U JPS6424848U JP1987120868U JP12086887U JPS6424848U JP S6424848 U JPS6424848 U JP S6424848U JP 1987120868 U JP1987120868 U JP 1987120868U JP 12086887 U JP12086887 U JP 12086887U JP S6424848 U JPS6424848 U JP S6424848U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の半導体装置の断面図。第２図
は従来の半導体装置の断面図。 １……基板、２……半導体チツプ、３……ワイ
ヤー、４……樹脂封止枠、５……樹脂。
は従来の半導体装置の断面図。 １……基板、２……半導体チツプ、３……ワイ
ヤー、４……樹脂封止枠、５……樹脂。
Claims (1)
- 樹脂封止半導体装置において、樹脂封止枠を具
備することを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987120868U JPS6424848U (ja) | 1987-08-06 | 1987-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987120868U JPS6424848U (ja) | 1987-08-06 | 1987-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424848U true JPS6424848U (ja) | 1989-02-10 |
Family
ID=31367364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987120868U Pending JPS6424848U (ja) | 1987-08-06 | 1987-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424848U (ja) |
-
1987
- 1987-08-06 JP JP1987120868U patent/JPS6424848U/ja active Pending