JPS6377351U - - Google Patents
Info
- Publication number
- JPS6377351U JPS6377351U JP17226286U JP17226286U JPS6377351U JP S6377351 U JPS6377351 U JP S6377351U JP 17226286 U JP17226286 U JP 17226286U JP 17226286 U JP17226286 U JP 17226286U JP S6377351 U JPS6377351 U JP S6377351U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- sio
- resin
- sealed
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
図面は本考案の一実施例の側断面図である。
１１……半導体チツプ、１４……ワイヤ、１５
……ＳｉＯ２、１６……樹脂、である。
……ＳｉＯ２、１６……樹脂、である。
Claims (1)
- 【実用新案登録請求の範囲】 半導体チツプとこの半導体チツプにボンデイン
グされているワイヤとがＳｉＯ２によつて被覆さ
れており、 且つ前記ＳｉＯ２によつて被覆されている状態
の前記半導体チツプと前記ワイヤとが樹脂封止さ
れている半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17226286U JPS6377351U (ja) | 1986-11-10 | 1986-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17226286U JPS6377351U (ja) | 1986-11-10 | 1986-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6377351U true JPS6377351U (ja) | 1988-05-23 |
Family
ID=31108645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17226286U Pending JPS6377351U (ja) | 1986-11-10 | 1986-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6377351U (ja) |
-
1986
- 1986-11-10 JP JP17226286U patent/JPS6377351U/ja active Pending