JPH0330436U - - Google Patents
Info
- Publication number
- JPH0330436U JPH0330436U JP8923989U JP8923989U JPH0330436U JP H0330436 U JPH0330436 U JP H0330436U JP 8923989 U JP8923989 U JP 8923989U JP 8923989 U JP8923989 U JP 8923989U JP H0330436 U JPH0330436 U JP H0330436U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead wire
- insulating material
- led out
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000013013 elastic material Substances 0.000 claims 2
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１実施例の断面図、第２図
は本考案の第２実施例の概略斜視図、第３図は従
来のパツケージの断面図である。 １……キヤツプ、２，３……電極、４……ガラ
ス、５……リード線、６……ゴム、７……ゴム材
、７ａ……穴。
は本考案の第２実施例の概略斜視図、第３図は従
来のパツケージの断面図である。 １……キヤツプ、２，３……電極、４……ガラ
ス、５……リード線、６……ゴム、７……ゴム材
、７ａ……穴。
Claims (1)
- キヤツプ内に配設した電極をガラス等の絶縁材
で封止し、かつこの電極に繋がるリード線を前記
絶縁材を通して外部に導出した半導体装置におい
て、前記リード線が絶縁材から導出される根本部
にゴム等の弾性材を配設し、この弾性材で前記リ
ード線の根本部を覆つたことを特徴とする半導体
装置のパツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8923989U JPH0330436U (ja) | 1989-07-31 | 1989-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8923989U JPH0330436U (ja) | 1989-07-31 | 1989-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330436U true JPH0330436U (ja) | 1991-03-26 |
Family
ID=31638829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8923989U Pending JPH0330436U (ja) | 1989-07-31 | 1989-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330436U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130094756A (ko) | 2012-02-16 | 2013-08-26 | 히다치 겡키 가부시키 가이샤 | 신축 로드 및 심굴 굴삭기 |
-
1989
- 1989-07-31 JP JP8923989U patent/JPH0330436U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130094756A (ko) | 2012-02-16 | 2013-08-26 | 히다치 겡키 가부시키 가이샤 | 신축 로드 및 심굴 굴삭기 |