JPH024250U - - Google Patents
Info
- Publication number
- JPH024250U JPH024250U JP8180588U JP8180588U JPH024250U JP H024250 U JPH024250 U JP H024250U JP 8180588 U JP8180588 U JP 8180588U JP 8180588 U JP8180588 U JP 8180588U JP H024250 U JPH024250 U JP H024250U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- leaving
- semiconductor device
- utility
- thin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
他の実施例の斜視図である。
他の実施例の斜視図である。
Claims (1)
- 樹脂封止型の半導体装置において、パツケージ
本体からリード曲げ開始点までモールド樹脂を薄
く残したことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180588U JPH024250U (ja) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180588U JPH024250U (ja) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024250U true JPH024250U (ja) | 1990-01-11 |
Family
ID=31306575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8180588U Pending JPH024250U (ja) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024250U (ja) |
-
1988
- 1988-06-20 JP JP8180588U patent/JPH024250U/ja active Pending