JPH0262727U - - Google Patents

Info

Publication number
JPH0262727U
JPH0262727U JP14208988U JP14208988U JPH0262727U JP H0262727 U JPH0262727 U JP H0262727U JP 14208988 U JP14208988 U JP 14208988U JP 14208988 U JP14208988 U JP 14208988U JP H0262727 U JPH0262727 U JP H0262727U
Authority
JP
Japan
Prior art keywords
resin
recesses
semiconductor device
sealed
external leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14208988U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14208988U priority Critical patent/JPH0262727U/ja
Publication of JPH0262727U publication Critical patent/JPH0262727U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図ａ及びｂは夫々本考案をＤＩＰ型パツケ
ージに適用した実施例の平面図及び正面図、第２
図ａ及びｂは夫々本考案をフラツト型パツケージ
に適用した実施例の平面図及び正面図である。 １，１１…樹脂パツケージ、２，１２…外部リ
ード、３，１３…凹部、４，１４…凸部、５，１
５…段部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止パツケージの側面から複数本の外部リ
    ードを突出した樹脂封止半導体装置において、前
    記樹脂封止パツケージの側面に凹部、凸部を交互
    に形成し、前記外部リードは隣接するリードが前
    記凹部、凸部から交互に突出されるように構成し
    たことを特徴とする樹脂封止半導体装置。
JP14208988U 1988-10-31 1988-10-31 Pending JPH0262727U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14208988U JPH0262727U (ja) 1988-10-31 1988-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14208988U JPH0262727U (ja) 1988-10-31 1988-10-31

Publications (1)

Publication Number Publication Date
JPH0262727U true JPH0262727U (ja) 1990-05-10

Family

ID=31407736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14208988U Pending JPH0262727U (ja) 1988-10-31 1988-10-31

Country Status (1)

Country Link
JP (1) JPH0262727U (ja)

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