JPH01113346U - - Google Patents
Info
- Publication number
- JPH01113346U JPH01113346U JP1988008029U JP802988U JPH01113346U JP H01113346 U JPH01113346 U JP H01113346U JP 1988008029 U JP1988008029 U JP 1988008029U JP 802988 U JP802988 U JP 802988U JP H01113346 U JPH01113346 U JP H01113346U
- Authority
- JP
- Japan
- Prior art keywords
- package
- concave
- encapsulated
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 230000009977 dual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図、第２図、第３図はそれぞれ本考案によ
るシングルインラインパツケージ、デユアルイン
ラインパツケージ、フラツトパツケージの構成斜
視図、第４図、第５図、第６図はそれぞれ第１図
、第２図、第３図に対応した従来の構成斜視図で
ある。各図において、 １：パツケージ、１ａ：凸部、１ｂ：凹部、２
：外部リード。
るシングルインラインパツケージ、デユアルイン
ラインパツケージ、フラツトパツケージの構成斜
視図、第４図、第５図、第６図はそれぞれ第１図
、第２図、第３図に対応した従来の構成斜視図で
ある。各図において、 １：パツケージ、１ａ：凸部、１ｂ：凹部、２
：外部リード。
Claims (1)
- 半導体デバイスを封止した樹脂パツケージの外
形側面を凹凸を呈する段付き形状と成し、かつ外
部リードをパツケージ外形の凹部、凸部よりジグ
ザグ配列に引出して構成したことを特徴とするＩ
Ｃパツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988008029U JPH01113346U (ja) | 1988-01-25 | 1988-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988008029U JPH01113346U (ja) | 1988-01-25 | 1988-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113346U true JPH01113346U (ja) | 1989-07-31 |
Family
ID=31213545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988008029U Pending JPH01113346U (ja) | 1988-01-25 | 1988-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113346U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11621216B2 (en) | 2018-08-20 | 2023-04-04 | Mitsubishi Electric Corporation | Semiconductor module |
-
1988
- 1988-01-25 JP JP1988008029U patent/JPH01113346U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11621216B2 (en) | 2018-08-20 | 2023-04-04 | Mitsubishi Electric Corporation | Semiconductor module |