JPH01123356U - - Google Patents
Info
- Publication number
- JPH01123356U JPH01123356U JP1908188U JP1908188U JPH01123356U JP H01123356 U JPH01123356 U JP H01123356U JP 1908188 U JP1908188 U JP 1908188U JP 1908188 U JP1908188 U JP 1908188U JP H01123356 U JPH01123356 U JP H01123356U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- leads
- semiconductor pellet
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例にかかる半導体装置
の一部破断斜視図、第２図は同実施例のモールド
樹脂を一点鎖線で示す上面図、第３図は他の実施
例にかかる半導体装置のモールド樹脂を一点鎖線
で示す上面図、第４図及び第５図は従来の半導体
装置のモールド樹脂を一点鎖線で示す側面図であ
る。 （符号の説明）、１…半導体ペレツト、１ａ，
１ｂ，１ｃ…電極、２…放熱板、５…凸出部、７
…リード、８…モールド樹脂。
の一部破断斜視図、第２図は同実施例のモールド
樹脂を一点鎖線で示す上面図、第３図は他の実施
例にかかる半導体装置のモールド樹脂を一点鎖線
で示す上面図、第４図及び第５図は従来の半導体
装置のモールド樹脂を一点鎖線で示す側面図であ
る。 （符号の説明）、１…半導体ペレツト、１ａ，
１ｂ，１ｃ…電極、２…放熱板、５…凸出部、７
…リード、８…モールド樹脂。
Claims (1)
- 【実用新案登録請求の範囲】 放熱板上にマウントした半導体ペレツトの近傍
に複数のリードの一端部を配置し、前記リードの
内少なくとも一本のリードを放熱板に接続し、放
熱板と接続されたリードを含むリードと半導体ペ
レツト上の電極とをそれぞれワイヤボンデイング
し、半導体ペレツトを含む主要部を樹脂モールド
した半導体装置において、 上記放熱板に接続されたリードの該放熱板とモ
ールド樹脂表面との間に、側方に凸出する凸出部
を設けたことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1908188U JPH01123356U (ja) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1908188U JPH01123356U (ja) | 1988-02-16 | 1988-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123356U true JPH01123356U (ja) | 1989-08-22 |
Family
ID=31234277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1908188U Pending JPH01123356U (ja) | 1988-02-16 | 1988-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123356U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996036074A1 (fr) * | 1995-05-11 | 1996-11-14 | Rohm Co., Ltd. | Dispositif semi-conducteur |
-
1988
- 1988-02-16 JP JP1908188U patent/JPH01123356U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996036074A1 (fr) * | 1995-05-11 | 1996-11-14 | Rohm Co., Ltd. | Dispositif semi-conducteur |