JPH0215736U - - Google Patents
Info
- Publication number
- JPH0215736U JPH0215736U JP9534288U JP9534288U JPH0215736U JP H0215736 U JPH0215736 U JP H0215736U JP 9534288 U JP9534288 U JP 9534288U JP 9534288 U JP9534288 U JP 9534288U JP H0215736 U JPH0215736 U JP H0215736U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- protrusion
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例１の平面図、第２図は
実施例１の側面図、第３図は実施例２の平面図、
第４図は実施例２の側面図である。 １……エポキシ系封止樹脂、２……金属リード
、３……凸型突起。
実施例１の側面図、第３図は実施例２の平面図、
第４図は実施例２の側面図である。 １……エポキシ系封止樹脂、２……金属リード
、３……凸型突起。
Claims (1)
- 半導体素子を樹脂封止してなる半導体装置にお
いて、該封止樹脂表面に突起部を設けたことを特
徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534288U JPH0215736U (ja) | 1988-07-18 | 1988-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534288U JPH0215736U (ja) | 1988-07-18 | 1988-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215736U true JPH0215736U (ja) | 1990-01-31 |
Family
ID=31320005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9534288U Pending JPH0215736U (ja) | 1988-07-18 | 1988-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215736U (ja) |
-
1988
- 1988-07-18 JP JP9534288U patent/JPH0215736U/ja active Pending