JPS61188957U - - Google Patents
Info
- Publication number
- JPS61188957U JPS61188957U JP6786586U JP6786586U JPS61188957U JP S61188957 U JPS61188957 U JP S61188957U JP 6786586 U JP6786586 U JP 6786586U JP 6786586 U JP6786586 U JP 6786586U JP S61188957 U JPS61188957 U JP S61188957U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- packaging
- utility
- scope
- conductive plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
- Packages (AREA)
Description
第１図は、本考案の一実施例を示したもので、
同図ａは断面図、同図ｂは平面図である。 １１，１３……導電性プラスチツクテープ、１
２……プラスチツク、１４……半導体素子。
同図ａは断面図、同図ｂは平面図である。 １１，１３……導電性プラスチツクテープ、１
２……プラスチツク、１４……半導体素子。
Claims (1)
- 導電性プラスチツクテープに、複数の凹状の半
導体素子挿入部を設けたことを特徴とする半導体
素子用包装。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6786586U JPS61188957U (ja) | 1986-05-06 | 1986-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6786586U JPS61188957U (ja) | 1986-05-06 | 1986-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61188957U true JPS61188957U (ja) | 1986-11-25 |
Family
ID=30602088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6786586U Pending JPS61188957U (ja) | 1986-05-06 | 1986-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61188957U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5027240U (ja) * | 1973-07-06 | 1975-03-28 |
-
1986
- 1986-05-06 JP JP6786586U patent/JPS61188957U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5027240U (ja) * | 1973-07-06 | 1975-03-28 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |