JPS6251242U - - Google Patents
Info
- Publication number
- JPS6251242U JPS6251242U JP1985143654U JP14365485U JPS6251242U JP S6251242 U JPS6251242 U JP S6251242U JP 1985143654 U JP1985143654 U JP 1985143654U JP 14365485 U JP14365485 U JP 14365485U JP S6251242 U JPS6251242 U JP S6251242U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor sensor
- sensor chip
- cylindrical
- case body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Measuring Fluid Pressure (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Pressure Sensors (AREA)
Description
第１図は本考案の一実施例を示す半導体センサ
ユニツトの平面図、第２図は第１図の断面図、第
３図は従来の半導体センサユニツトの構造を示す
平面図、第４図は第３図の断面図である。 １，１１……半導体センサチツプ、３，１３…
…ケース体、３ａ……第一の凹部、３ｂ……第二
の凹部、５，１５……半導体センサユニツト。
ユニツトの平面図、第２図は第１図の断面図、第
３図は従来の半導体センサユニツトの構造を示す
平面図、第４図は第３図の断面図である。 １，１１……半導体センサチツプ、３，１３…
…ケース体、３ａ……第一の凹部、３ｂ……第二
の凹部、５，１５……半導体センサユニツト。
Claims (1)
- 円筒型形状を有するケース体に円筒形状の第一
の凹部と矩形形状の第二の凹部を設け、該第二の
凹部内に半導体センサチツプを収納すると共に、
第二の凹部が形成されていない前記第一凹部の底
部に前記半導体センサチツプのリード線を接続す
るためのパターンを形成した半導体センサユニツ
ト。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985143654U JPS6251242U (ja) | 1985-09-20 | 1985-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985143654U JPS6251242U (ja) | 1985-09-20 | 1985-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6251242U true JPS6251242U (ja) | 1987-03-30 |
Family
ID=31053540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985143654U Pending JPS6251242U (ja) | 1985-09-20 | 1985-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6251242U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016003910A (ja) * | 2014-06-16 | 2016-01-12 | アルプス電気株式会社 | 圧力検出装置及びその製造方法 |
-
1985
- 1985-09-20 JP JP1985143654U patent/JPS6251242U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016003910A (ja) * | 2014-06-16 | 2016-01-12 | アルプス電気株式会社 | 圧力検出装置及びその製造方法 |