JPH0279046U - - Google Patents

Info

Publication number
JPH0279046U
JPH0279046U JP15920588U JP15920588U JPH0279046U JP H0279046 U JPH0279046 U JP H0279046U JP 15920588 U JP15920588 U JP 15920588U JP 15920588 U JP15920588 U JP 15920588U JP H0279046 U JPH0279046 U JP H0279046U
Authority
JP
Japan
Prior art keywords
semiconductor element
ceramic substrate
semiconductor device
metallized layer
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15920588U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15920588U priority Critical patent/JPH0279046U/ja
Publication of JPH0279046U publication Critical patent/JPH0279046U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例のセラミツク基板樹
脂封止半導体装置の断面図、第2図は該一実施例
の平面図、第3図は従来のセラミツク基板樹脂封
止半導体装置の断面図、第4図は本考案の他の実
施例の断面図である。 1……セラミツク基板、2……外部リード、3
……メタライズ層、4……半導体素子、5……金
細線、6……封止樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミツク基板表面に外部端子と連結されたメ
    タライズ層を有し、前記メタライズ層上に半導体
    素子が搭載され、該半導体素子を樹脂封止してな
    る半導体装置において、前記セラミツク基板の前
    記半導体素子搭載部分が、その周辺部分に対し、
    凹形状をなし、該凹形状部分を完全に覆うように
    封止樹脂を有することを特徴とする半導体装置。
JP15920588U 1988-12-06 1988-12-06 Pending JPH0279046U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15920588U JPH0279046U (ja) 1988-12-06 1988-12-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15920588U JPH0279046U (ja) 1988-12-06 1988-12-06

Publications (1)

Publication Number Publication Date
JPH0279046U true JPH0279046U (ja) 1990-06-18

Family

ID=31440208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15920588U Pending JPH0279046U (ja) 1988-12-06 1988-12-06

Country Status (1)

Country Link
JP (1) JPH0279046U (ja)

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