JPH0343732U - - Google Patents
Info
- Publication number
- JPH0343732U JPH0343732U JP10468989U JP10468989U JPH0343732U JP H0343732 U JPH0343732 U JP H0343732U JP 10468989 U JP10468989 U JP 10468989U JP 10468989 U JP10468989 U JP 10468989U JP H0343732 U JPH0343732 U JP H0343732U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- semiconductor element
- bonding pad
- electrically connected
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Description
第１図は本考案による半導体素子の実装構造の
一実施例を示す断面図である。第２図は従来の半
導体素子の実装構造の一例を示す断面図である。 １１……半導体素子、１２……金属基板、１３
……金属基材、１５……導電パターン、１５ａ…
…ボンデイングパツド、１５ｂ……電極、１６…
…金線、１７……導電性接着剤、１８……金属ネ
ジ。
一実施例を示す断面図である。第２図は従来の半
導体素子の実装構造の一例を示す断面図である。 １１……半導体素子、１２……金属基板、１３
……金属基材、１５……導電パターン、１５ａ…
…ボンデイングパツド、１５ｂ……電極、１６…
…金線、１７……導電性接着剤、１８……金属ネ
ジ。
Claims (1)
- 金属基板上に該金属基板の導電層を利用して設
けられたボンデイングパツドと、該ボンデイング
パツド上にダイボンデイングされた半導体素子と
、上記金属基板の表面に形成された導電パターン
でなる電極とを具備しており、該電極と半導体素
子がワイヤボンデイングされることにより電気的
に接続され且つ上記ボンデイングパツドと上記金
属基板の金属基材とが導電部材を介して電気的に
接続されていることを特徴とする、半導体素子の
実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10468989U JPH0343732U (ja) | 1989-09-06 | 1989-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10468989U JPH0343732U (ja) | 1989-09-06 | 1989-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0343732U true JPH0343732U (ja) | 1991-04-24 |
Family
ID=31653476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10468989U Pending JPH0343732U (ja) | 1989-09-06 | 1989-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343732U (ja) |
-
1989
- 1989-09-06 JP JP10468989U patent/JPH0343732U/ja active Pending