JPS62199948U - - Google Patents
Info
- Publication number
- JPS62199948U JPS62199948U JP8814186U JP8814186U JPS62199948U JP S62199948 U JPS62199948 U JP S62199948U JP 8814186 U JP8814186 U JP 8814186U JP 8814186 U JP8814186 U JP 8814186U JP S62199948 U JPS62199948 U JP S62199948U
- Authority
- JP
- Japan
- Prior art keywords
- board
- substrate
- wire bonding
- auxiliary
- semiconductor circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000003566 sealing material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は従来の半導体回路基板を示す断面図である。 １……主基板、２……ＩＣ素子、３……透孔、
４……補助基板。
は従来の半導体回路基板を示す断面図である。 １……主基板、２……ＩＣ素子、３……透孔、
４……補助基板。
Claims (1)
- ＩＣ素子をワイヤボンデイングにより基板パタ
ーンと接続して回路構成した半導体回路基板にお
いて、ＩＣ素子塔載部位に透孔を穿設した主基板
と、ＩＣ素子を塔載した薄膜状補助基板とからな
り、このＩＣ素子を前記透孔に遊挿して補助基板
を主基板に接着し、ワイヤボンデイングした後、
その上面に封止材を被着した半導体回路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8814186U JPS62199948U (ja) | 1986-06-10 | 1986-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8814186U JPS62199948U (ja) | 1986-06-10 | 1986-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199948U true JPS62199948U (ja) | 1987-12-19 |
Family
ID=30945980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8814186U Pending JPS62199948U (ja) | 1986-06-10 | 1986-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199948U (ja) |
-
1986
- 1986-06-10 JP JP8814186U patent/JPS62199948U/ja active Pending