JPS6377352U - - Google Patents

Info

Publication number
JPS6377352U
JPS6377352U JP17199786U JP17199786U JPS6377352U JP S6377352 U JPS6377352 U JP S6377352U JP 17199786 U JP17199786 U JP 17199786U JP 17199786 U JP17199786 U JP 17199786U JP S6377352 U JPS6377352 U JP S6377352U
Authority
JP
Japan
Prior art keywords
bump part
bump
semiconductor element
sealed
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17199786U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17199786U priority Critical patent/JPS6377352U/ja
Publication of JPS6377352U publication Critical patent/JPS6377352U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第1図は本考案による半導体素子の一実施例の
断面図、第2図は第1図のヒートシンクの平面図
、第3図は本考案による半導体素子の他の実施例
の断面図、第4図は従来の半導体素子の実装構造
を示す断面図である。 1…半導体素子、2…バンプ、3…基板、4…
樹脂、5…ヒートシンク、6…樹脂接着剤、7…
導電性コネクタ、8…位置合せマーク、9…金属
柱。

Claims (1)

    【実用新案登録請求の範囲】
  1. バンプ部を介して基板に接続される半導体素子
    において、前記バンプ部を除く表面全体を封止部
    材によつて封止するとともに、前記バンプ部の形
    成されていない面に放熱部を設けたことを特徴と
    する半導体素子。
JP17199786U 1986-11-11 1986-11-11 Pending JPS6377352U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17199786U JPS6377352U (ja) 1986-11-11 1986-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17199786U JPS6377352U (ja) 1986-11-11 1986-11-11

Publications (1)

Publication Number Publication Date
JPS6377352U true JPS6377352U (ja) 1988-05-23

Family

ID=31108141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17199786U Pending JPS6377352U (ja) 1986-11-11 1986-11-11

Country Status (1)

Country Link
JP (1) JPS6377352U (ja)

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