JPS631341U - - Google Patents
Info
- Publication number
- JPS631341U JPS631341U JP1986093289U JP9328986U JPS631341U JP S631341 U JPS631341 U JP S631341U JP 1986093289 U JP1986093289 U JP 1986093289U JP 9328986 U JP9328986 U JP 9328986U JP S631341 U JPS631341 U JP S631341U
- Authority
- JP
- Japan
- Prior art keywords
- bump portion
- semiconductor device
- sealed
- utility
- sealing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に半導体素子の一実施例を実装
状態で示した断面図、第２図イは第１図の半導体
素子の側面図、ロは平面図、第３図は本考案によ
る半導体素子を形成するための工程図、第４図は
従来の半導体素子を実装状態で示した断面図であ
る。 １…基板、１ａ…配線、２…バンプ、３…半導
体素子、４…樹脂、５…ダム、６…半田、７…下
型、８…上型。
状態で示した断面図、第２図イは第１図の半導体
素子の側面図、ロは平面図、第３図は本考案によ
る半導体素子を形成するための工程図、第４図は
従来の半導体素子を実装状態で示した断面図であ
る。 １…基板、１ａ…配線、２…バンプ、３…半導
体素子、４…樹脂、５…ダム、６…半田、７…下
型、８…上型。
Claims (1)
- バンプ部を介して基板に接続される半導体素子
において、前記バンプ部を除く表面全体を封止部
材によつて封止したことを特徴とする半導体素子
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986093289U JPS631341U (ja) | 1986-06-20 | 1986-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986093289U JPS631341U (ja) | 1986-06-20 | 1986-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS631341U true JPS631341U (ja) | 1988-01-07 |
Family
ID=30955751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986093289U Pending JPS631341U (ja) | 1986-06-20 | 1986-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS631341U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249460A (ja) * | 1988-08-11 | 1990-02-19 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPH02189926A (ja) * | 1989-01-18 | 1990-07-25 | Nec Corp | 半導体集積回路装置 |
-
1986
- 1986-06-20 JP JP1986093289U patent/JPS631341U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249460A (ja) * | 1988-08-11 | 1990-02-19 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPH02189926A (ja) * | 1989-01-18 | 1990-07-25 | Nec Corp | 半導体集積回路装置 |