JPH0476046U - - Google Patents

Info

Publication number
JPH0476046U
JPH0476046U JP1990119868U JP11986890U JPH0476046U JP H0476046 U JPH0476046 U JP H0476046U JP 1990119868 U JP1990119868 U JP 1990119868U JP 11986890 U JP11986890 U JP 11986890U JP H0476046 U JPH0476046 U JP H0476046U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
power semiconductor
insulating layer
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990119868U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990119868U priority Critical patent/JPH0476046U/ja
Publication of JPH0476046U publication Critical patent/JPH0476046U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図ａ及びｂはそれぞれ、本考案の一実施例
による電力半導体装置の平面図及び側面図、第２
図ａ及びｂはそれぞれ、本考案の他の実施例によ
る電力半導体装置の平面図及び側面図、第３図ａ
及びｂはそれぞれ、従来例による電力半導体装置
の平面図及び側面図である。 １……リードフレーム、２……半導体素子、３
……電子部品、４……樹脂、９……絶縁層。

Claims (1)

  1. 【実用新案登録請求の範囲】 リードフレーム上に半導体素子及び電子部品が
    搭載され、これらが樹脂によつて樹脂封止されて
    なる電力半導体装置において、 前記リードフレーム下面に絶縁層を形成し、該
    絶縁層を含めて樹脂封止してなることを特徴とす
    る電力半導体装置。
JP1990119868U 1990-11-15 1990-11-15 Pending JPH0476046U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119868U JPH0476046U (ja) 1990-11-15 1990-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119868U JPH0476046U (ja) 1990-11-15 1990-11-15

Publications (1)

Publication Number Publication Date
JPH0476046U true JPH0476046U (ja) 1992-07-02

Family

ID=31867800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119868U Pending JPH0476046U (ja) 1990-11-15 1990-11-15

Country Status (1)

Country Link
JP (1) JPH0476046U (ja)

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