JPS6322747U - - Google Patents

Info

Publication number
JPS6322747U
JPS6322747U JP1986117004U JP11700486U JPS6322747U JP S6322747 U JPS6322747 U JP S6322747U JP 1986117004 U JP1986117004 U JP 1986117004U JP 11700486 U JP11700486 U JP 11700486U JP S6322747 U JPS6322747 U JP S6322747U
Authority
JP
Japan
Prior art keywords
resin
lead
sealed
base
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986117004U
Other languages
English (en)
Other versions
JPH066509Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986117004U priority Critical patent/JPH066509Y2/ja
Publication of JPS6322747U publication Critical patent/JPS6322747U/ja
Application granted granted Critical
Publication of JPH066509Y2 publication Critical patent/JPH066509Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の半導体装置に使用するリ
ードフレームの一実施例であり、同図ａは、その
平面図、同図ｂは、同図ａのＸ―Ｘ線に沿う断面
図、同図ｃは、上記のリードフレームを用いて樹
脂モールドし、この考案の半導体装置を製作する
場合の説明図、第２図ａ，ｂ，ｃは、上記リード
フレームのベース部に設ける樹脂流通孔の他の実
施例を示す平面図および断面図、第３図ａは、従
来の半導体装置に使用するリードフレームの平面
図、同図ｂ，ｃは、上記リードフレームを使用し
て樹脂封止した半導体装置の平面図および断面図
、第４図ａ，ｂ，ｃは、樹脂封止する場合の金型
キヤビテイ内の様子を示す説明図である。 １……リードフレーム、２……連結部、３，３
ａ……リード部、４……ベース部、５……半導体
チツプ、６……リード線、９……キヤビテイ、１
０……流動樹脂、１２……樹脂流通孔。なお、各
図中、同一符号は同一または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 連結部から直角に延びるリード部と、このリー
    ド部の先端に形成されたベース部とを有するリー
    ドフレームの前記ベース部の一方の主面側に半導
    体チツプが搭載され、この半導体チツプを含んで
    前記ベース部の全体およびリード部の一部が樹脂
    封止される樹脂封止型半導体装置において、前記
    ベース部の全体およびリード部の一部が樹脂封止
    される際に、樹脂封止用に使用される流動樹脂が
    前記ベース部の他方の主面側に流れるための樹脂
    流通孔を、前記ベース部に設けたことを特徴とす
    る樹脂封止型半導体装置。
JP1986117004U 1986-07-30 1986-07-30 樹脂封止型半導体装置 Expired - Lifetime JPH066509Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986117004U JPH066509Y2 (ja) 1986-07-30 1986-07-30 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986117004U JPH066509Y2 (ja) 1986-07-30 1986-07-30 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6322747U true JPS6322747U (ja) 1988-02-15
JPH066509Y2 JPH066509Y2 (ja) 1994-02-16

Family

ID=31002122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986117004U Expired - Lifetime JPH066509Y2 (ja) 1986-07-30 1986-07-30 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPH066509Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231742A (ja) * 2008-03-25 2009-10-08 Shindengen Electric Mfg Co Ltd 半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029672A (ja) * 1973-07-17 1975-03-25
JPS5745961A (en) * 1980-09-04 1982-03-16 Toshiba Corp Resin-sealed semiconductor device
JPS57211761A (en) * 1981-06-23 1982-12-25 Nec Corp Semiconductor device
JPS5991747U (ja) * 1982-12-09 1984-06-21 日本電気ホームエレクトロニクス株式会社 半導体装置
JPS6083242U (ja) * 1983-11-15 1985-06-08 松下電工株式会社 電子回路素子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029672A (ja) * 1973-07-17 1975-03-25
JPS5745961A (en) * 1980-09-04 1982-03-16 Toshiba Corp Resin-sealed semiconductor device
JPS57211761A (en) * 1981-06-23 1982-12-25 Nec Corp Semiconductor device
JPS5991747U (ja) * 1982-12-09 1984-06-21 日本電気ホームエレクトロニクス株式会社 半導体装置
JPS6083242U (ja) * 1983-11-15 1985-06-08 松下電工株式会社 電子回路素子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231742A (ja) * 2008-03-25 2009-10-08 Shindengen Electric Mfg Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH066509Y2 (ja) 1994-02-16

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