JPS61190141U - - Google Patents

Info

Publication number
JPS61190141U
JPS61190141U JP7525385U JP7525385U JPS61190141U JP S61190141 U JPS61190141 U JP S61190141U JP 7525385 U JP7525385 U JP 7525385U JP 7525385 U JP7525385 U JP 7525385U JP S61190141 U JPS61190141 U JP S61190141U
Authority
JP
Japan
Prior art keywords
semiconductor element
conductive resin
resin
heat sink
adhering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7525385U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7525385U priority Critical patent/JPS61190141U/ja
Publication of JPS61190141U publication Critical patent/JPS61190141U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案の一実施例の斜投影図である。 1…樹脂製キヤツプ、2…樹脂製接着剤、3…
金属性放熱板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 導電性樹脂による樹脂キヤツプを半導体素子の
    載置された放熱板に導電性樹脂によつて接着する
    ことにより、前記半導体素子を封止したことを特
    徴とする集積回路装置。
JP7525385U 1985-05-20 1985-05-20 Pending JPS61190141U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7525385U JPS61190141U (ja) 1985-05-20 1985-05-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7525385U JPS61190141U (ja) 1985-05-20 1985-05-20

Publications (1)

Publication Number Publication Date
JPS61190141U true JPS61190141U (ja) 1986-11-27

Family

ID=30616300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7525385U Pending JPS61190141U (ja) 1985-05-20 1985-05-20

Country Status (1)

Country Link
JP (1) JPS61190141U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009540566A (ja) * 2006-06-05 2009-11-19 アクスティカ,インコーポレイテッド Memsデバイスおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009540566A (ja) * 2006-06-05 2009-11-19 アクスティカ,インコーポレイテッド Memsデバイスおよびその製造方法

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