JPS6390834U - - Google Patents
Info
- Publication number
- JPS6390834U JPS6390834U JP18628286U JP18628286U JPS6390834U JP S6390834 U JPS6390834 U JP S6390834U JP 18628286 U JP18628286 U JP 18628286U JP 18628286 U JP18628286 U JP 18628286U JP S6390834 U JPS6390834 U JP S6390834U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting plate
- silicon
- medium
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
図面は、この考案の半導体装置の一実施例の断
面図である。 １…半導体素子、２…鉄製の取り付け板、３…
半田層。
面図である。 １…半導体素子、２…鉄製の取り付け板、３…
半田層。
Claims (1)
- 材料がシリコンの半導体素子と、この半導体素
子を取り付ける鉄製の取り付け板とにより構成さ
れた中容量のパワー半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18628286U JPS6390834U (ja) | 1986-12-03 | 1986-12-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18628286U JPS6390834U (ja) | 1986-12-03 | 1986-12-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6390834U true JPS6390834U (ja) | 1988-06-13 |
Family
ID=31135700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18628286U Pending JPS6390834U (ja) | 1986-12-03 | 1986-12-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390834U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5079265A (ja) * | 1973-11-09 | 1975-06-27 |
-
1986
- 1986-12-03 JP JP18628286U patent/JPS6390834U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5079265A (ja) * | 1973-11-09 | 1975-06-27 |