JPH02114946U - - Google Patents
Info
- Publication number
- JPH02114946U JPH02114946U JP1989024346U JP2434689U JPH02114946U JP H02114946 U JPH02114946 U JP H02114946U JP 1989024346 U JP1989024346 U JP 1989024346U JP 2434689 U JP2434689 U JP 2434689U JP H02114946 U JPH02114946 U JP H02114946U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- semiconductor device
- semiconductor
- heat sink
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案による一実施例を示すヒートシ
ンクが取り付けられた半導体装置の断面図、第２
図は従来の一例を示すヒートシンクが取り付けら
れた半導体装置の断面図である。 １……ヒートシンク、２……永久磁石、３……
パツケージ、４……半導体チツプ、５……台座、
６……金属細線、７……蓋、８……金属板、９…
…ろう材。
ンクが取り付けられた半導体装置の断面図、第２
図は従来の一例を示すヒートシンクが取り付けら
れた半導体装置の断面図である。 １……ヒートシンク、２……永久磁石、３……
パツケージ、４……半導体チツプ、５……台座、
６……金属細線、７……蓋、８……金属板、９…
…ろう材。
Claims (1)
- 半導体チツプが搭載された金属板の一面を露出
して他の外郭体面を包合するパツケージを有する
半導体装置の前記露出する金属板の一面に吸着す
る永久磁石が前記半導体装置が取り付けられる面
に設けられたことを特徴とする半導体装置用ヒー
トシンク。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024346U JPH02114946U (ja) | 1989-03-02 | 1989-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024346U JPH02114946U (ja) | 1989-03-02 | 1989-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114946U true JPH02114946U (ja) | 1990-09-14 |
Family
ID=31244114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989024346U Pending JPH02114946U (ja) | 1989-03-02 | 1989-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114946U (ja) |
-
1989
- 1989-03-02 JP JP1989024346U patent/JPH02114946U/ja active Pending