JPS6365267U - - Google Patents
Info
- Publication number
- JPS6365267U JPS6365267U JP16108286U JP16108286U JPS6365267U JP S6365267 U JPS6365267 U JP S6365267U JP 16108286 U JP16108286 U JP 16108286U JP 16108286 U JP16108286 U JP 16108286U JP S6365267 U JPS6365267 U JP S6365267U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- board
- mounting
- leads
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは夫々本考案で用いる半導体装置
の斜視図および本考案の一実施例を示す断面図、
第２図ａ，ｂは従来例図である。 １，２……リード、３……半導体本体、４……
半田、５……基板。
の斜視図および本考案の一実施例を示す断面図、
第２図ａ，ｂは従来例図である。 １，２……リード、３……半導体本体、４……
半田、５……基板。
Claims (1)
- 半導体装置を実装基板に埋め込み、さらに該基
板の両面より前記装置のリードが出るようにした
半導体装置の実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16108286U JPS6365267U (ja) | 1986-10-20 | 1986-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16108286U JPS6365267U (ja) | 1986-10-20 | 1986-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6365267U true JPS6365267U (ja) | 1988-04-30 |
Family
ID=31087060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16108286U Pending JPS6365267U (ja) | 1986-10-20 | 1986-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6365267U (ja) |
-
1986
- 1986-10-20 JP JP16108286U patent/JPS6365267U/ja active Pending