JPS6278747U - - Google Patents
Info
- Publication number
- JPS6278747U JPS6278747U JP17004285U JP17004285U JPS6278747U JP S6278747 U JPS6278747 U JP S6278747U JP 17004285 U JP17004285 U JP 17004285U JP 17004285 U JP17004285 U JP 17004285U JP S6278747 U JPS6278747 U JP S6278747U
- Authority
- JP
- Japan
- Prior art keywords
- silicon wafer
- semiconductor device
- electrode plate
- protective electrode
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図はこの考案の半導体素子の一実施例を示
す断面図、第２図は従来のダイオード素子の一例
を示す断面図である。 図において、１はシリコンウエハ、３はろう材
、１２は保護電極板、１２ａは固着部である。な
お、各図中の同一符号は同一または相当部分を示
す。
す断面図、第２図は従来のダイオード素子の一例
を示す断面図である。 図において、１はシリコンウエハ、３はろう材
、１２は保護電極板、１２ａは固着部である。な
お、各図中の同一符号は同一または相当部分を示
す。
Claims (1)
- 少なくとも１つ以上のＰＮ接合を有するシリコ
ンウエハと、このシリコンウエハにアルミニウム
を主成分とするろう材を用いて固着される保護電
極板とを有する半導体素子において、前記保護電
極板のシリコンウエハとの固着部をその周囲より
も高い形状としたことを特徴とする半導体素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17004285U JPS6278747U (ja) | 1985-11-05 | 1985-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17004285U JPS6278747U (ja) | 1985-11-05 | 1985-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6278747U true JPS6278747U (ja) | 1987-05-20 |
Family
ID=31104409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17004285U Pending JPS6278747U (ja) | 1985-11-05 | 1985-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6278747U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |
-
1985
- 1985-11-05 JP JP17004285U patent/JPS6278747U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |