JPH01154646U - - Google Patents
Info
- Publication number
- JPH01154646U JPH01154646U JP1988052636U JP5263688U JPH01154646U JP H01154646 U JPH01154646 U JP H01154646U JP 1988052636 U JP1988052636 U JP 1988052636U JP 5263688 U JP5263688 U JP 5263688U JP H01154646 U JPH01154646 U JP H01154646U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat sink
- protrusion
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Description
第１図はこの考案の一実施例による半導体装置
の断面図、第２図は従来の半導体装置の断面図で
ある。 図において、１は半導体素子、２は放熱体、２
ａは放熱体の凹部、３ははんだ、４は突起部であ
る。なお、図中、同一符号は同一、又は相当部分
を示す。
の断面図、第２図は従来の半導体装置の断面図で
ある。 図において、１は半導体素子、２は放熱体、２
ａは放熱体の凹部、３ははんだ、４は突起部であ
る。なお、図中、同一符号は同一、又は相当部分
を示す。
Claims (1)
- 半導体素子とこの半導体素子が載置される突起
部を有する放熱体を備えたことを特徴とする半導
体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988052636U JPH01154646U (ja) | 1988-04-18 | 1988-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988052636U JPH01154646U (ja) | 1988-04-18 | 1988-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154646U true JPH01154646U (ja) | 1989-10-24 |
Family
ID=31278642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988052636U Pending JPH01154646U (ja) | 1988-04-18 | 1988-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154646U (ja) |
-
1988
- 1988-04-18 JP JP1988052636U patent/JPH01154646U/ja active Pending