JPS6186939U - - Google Patents
Info
- Publication number
- JPS6186939U JPS6186939U JP17047084U JP17047084U JPS6186939U JP S6186939 U JPS6186939 U JP S6186939U JP 17047084 U JP17047084 U JP 17047084U JP 17047084 U JP17047084 U JP 17047084U JP S6186939 U JPS6186939 U JP S6186939U
- Authority
- JP
- Japan
- Prior art keywords
- supporting member
- semiconductor
- metal
- semiconductor substrate
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の半導体装置の要部断面図、第
２図は金属支持部材の斜視図、第３図は従来の半
導体装置の要部断面図である。 １……金属支持部材、２……半導体基体、３…
…はんだ層、４……凸起。
２図は金属支持部材の斜視図、第３図は従来の半
導体装置の要部断面図である。 １……金属支持部材、２……半導体基体、３…
…はんだ層、４……凸起。
Claims (1)
- 半導体基体と、上記半導体を搭載する金属支技
部材と、半導体基体と支持部材とを接着する金属
ろう層とからなる半導体装置において、上記金属
支持部材に凸起を形成した半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17047084U JPS6186939U (ja) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17047084U JPS6186939U (ja) | 1984-11-12 | 1984-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6186939U true JPS6186939U (ja) | 1986-06-07 |
Family
ID=30728178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17047084U Pending JPS6186939U (ja) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6186939U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2020175619A1 (ja) * | 2019-02-28 | 2021-12-16 | 京セラ株式会社 | 電子部品搭載用パッケージ、電子装置及び発光装置 |
-
1984
- 1984-11-12 JP JP17047084U patent/JPS6186939U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2020175619A1 (ja) * | 2019-02-28 | 2021-12-16 | 京セラ株式会社 | 電子部品搭載用パッケージ、電子装置及び発光装置 |