JPH0472638U - - Google Patents

Info

Publication number
JPH0472638U
JPH0472638U JP1990115194U JP11519490U JPH0472638U JP H0472638 U JPH0472638 U JP H0472638U JP 1990115194 U JP1990115194 U JP 1990115194U JP 11519490 U JP11519490 U JP 11519490U JP H0472638 U JPH0472638 U JP H0472638U
Authority
JP
Japan
Prior art keywords
convex mounting
metal base
package
semiconductor elements
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990115194U
Other languages
English (en)
Other versions
JP2515672Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990115194U priority Critical patent/JP2515672Y2/ja
Publication of JPH0472638U publication Critical patent/JPH0472638U/ja
Application granted granted Critical
Publication of JP2515672Y2 publication Critical patent/JP2515672Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は従来の
半導体素子収納用パツケージの断面図である。 １……金属基体、１ａ……凸状載置部、２……
絶縁枠体、４……絶縁被覆層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 上面中央部に半導体素子が載置される凸状の載
    置部を有する金属基体に、該凸状載置部を囲繞す
    るようにして絶縁枠体を取着して成る半導体素子
    収納用パツケージにおいて、前記金属基体に設け
    た凸状載置部の上面外周角部に３０乃至６０°の
    傾斜状の面取りを施すとともに該凸状載置部の上
    面に絶縁被覆層を被着させたことを特徴とする半
    導体素子収納用パツケージ。
JP1990115194U 1990-10-31 1990-10-31 半導体素子収納用パッケージ Expired - Lifetime JP2515672Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990115194U JP2515672Y2 (ja) 1990-10-31 1990-10-31 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990115194U JP2515672Y2 (ja) 1990-10-31 1990-10-31 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0472638U true JPH0472638U (ja) 1992-06-26
JP2515672Y2 JP2515672Y2 (ja) 1996-10-30

Family

ID=31862938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990115194U Expired - Lifetime JP2515672Y2 (ja) 1990-10-31 1990-10-31 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2515672Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6450438U (ja) * 1987-09-24 1989-03-29
JPH0187547U (ja) * 1987-12-02 1989-06-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6450438U (ja) * 1987-09-24 1989-03-29
JPH0187547U (ja) * 1987-12-02 1989-06-09

Also Published As

Publication number Publication date
JP2515672Y2 (ja) 1996-10-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term