JPS6364047U - - Google Patents

Info

Publication number
JPS6364047U
JPS6364047U JP1986157157U JP15715786U JPS6364047U JP S6364047 U JPS6364047 U JP S6364047U JP 1986157157 U JP1986157157 U JP 1986157157U JP 15715786 U JP15715786 U JP 15715786U JP S6364047 U JPS6364047 U JP S6364047U
Authority
JP
Japan
Prior art keywords
package
protrusion
metal base
insulating frame
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986157157U
Other languages
English (en)
Other versions
JPH0617303Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986157157U priority Critical patent/JPH0617303Y2/ja
Publication of JPS6364047U publication Critical patent/JPS6364047U/ja
Application granted granted Critical
Publication of JPH0617303Y2 publication Critical patent/JPH0617303Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本考案の半導体素子収納用パツケージ
の断面図、第2図は第1図の半導体素子収納用パ
ツケージのうち蓋体を取り除いた状態の平面図、
第3図は従来の半導体素子収納用パツケージの断
面図、第4図は第3図の半導体素子収納用パツケ
ージのうち蓋体を取り除いた状態の平面図である
。 1:金属基体、1a:凸部、1b:スペーサ部
、2:絶縁枠体、3:半導体素子、4:導電層、
5:外部リード端子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 中央部に半導体素子が載置される凸部を有する
    金属基体上に、前記凸部を囲繞するようにして絶
    縁枠体を取着して成る半導体素子収納用パツケー
    ジにおいて、前記金属基体の凸部側面もしくは絶
    縁枠体の内周面の一部にスペーサ部を設けたこと
    を特徴とする半導体素子収納用パツケージ。
JP1986157157U 1986-10-14 1986-10-14 半導体素子収納用パツケ−ジ Expired - Lifetime JPH0617303Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986157157U JPH0617303Y2 (ja) 1986-10-14 1986-10-14 半導体素子収納用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986157157U JPH0617303Y2 (ja) 1986-10-14 1986-10-14 半導体素子収納用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6364047U true JPS6364047U (ja) 1988-04-27
JPH0617303Y2 JPH0617303Y2 (ja) 1994-05-02

Family

ID=31079446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986157157U Expired - Lifetime JPH0617303Y2 (ja) 1986-10-14 1986-10-14 半導体素子収納用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPH0617303Y2 (ja)

Also Published As

Publication number Publication date
JPH0617303Y2 (ja) 1994-05-02

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