JPS6450438U - - Google Patents
Info
- Publication number
- JPS6450438U JPS6450438U JP1987145802U JP14580287U JPS6450438U JP S6450438 U JPS6450438 U JP S6450438U JP 1987145802 U JP1987145802 U JP 1987145802U JP 14580287 U JP14580287 U JP 14580287U JP S6450438 U JPS6450438 U JP S6450438U
- Authority
- JP
- Japan
- Prior art keywords
- package
- coating film
- metal base
- heat
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……金属基体、１ａ……半導体素子載置部、
２……絶縁性枠体、９……耐熱性絶縁被覆膜。
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……金属基体、１ａ……半導体素子載置部、
２……絶縁性枠体、９……耐熱性絶縁被覆膜。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 上面中央部に半導体素子が載置される載置
部を有する金属基体上面に、該載置部を囲繞する
ようにして絶縁性枠体を取着して成る半導体素子
収納用パツケージにおいて、前記金属基体の少な
くとも下面全面に耐熱性絶縁被覆膜を被着させた
ことを特徴とする半導体素子収納用パツケージ。 (2) 前記耐熱性絶縁被覆膜の膜厚が２．０乃至
５０．０μｍであることを特徴とする実用新案登
録請求の範囲第１項記載の半導体素子収納用パツ
ケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987145802U JPH0610695Y2 (ja) | 1987-09-24 | 1987-09-24 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987145802U JPH0610695Y2 (ja) | 1987-09-24 | 1987-09-24 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6450438U true JPS6450438U (ja) | 1989-03-29 |
| JPH0610695Y2 JPH0610695Y2 (ja) | 1994-03-16 |
Family
ID=31414710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987145802U Expired - Lifetime JPH0610695Y2 (ja) | 1987-09-24 | 1987-09-24 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610695Y2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0472638U (ja) * | 1990-10-31 | 1992-06-26 | ||
| WO2019039258A1 (ja) * | 2017-08-25 | 2019-02-28 | 京セラ株式会社 | 電子部品搭載用パッケージおよび電子装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
| JPS61168640U (ja) * | 1985-04-05 | 1986-10-20 | ||
| JPS6473750A (en) * | 1987-09-16 | 1989-03-20 | Nec Corp | Semiconductor device |
-
1987
- 1987-09-24 JP JP1987145802U patent/JPH0610695Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
| JPS61168640U (ja) * | 1985-04-05 | 1986-10-20 | ||
| JPS6473750A (en) * | 1987-09-16 | 1989-03-20 | Nec Corp | Semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0472638U (ja) * | 1990-10-31 | 1992-06-26 | ||
| WO2019039258A1 (ja) * | 2017-08-25 | 2019-02-28 | 京セラ株式会社 | 電子部品搭載用パッケージおよび電子装置 |
| JPWO2019039258A1 (ja) * | 2017-08-25 | 2020-09-17 | 京セラ株式会社 | 電子部品搭載用パッケージおよび電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0610695Y2 (ja) | 1994-03-16 |