JPS61146960U - - Google Patents
Info
- Publication number
- JPS61146960U JPS61146960U JP3058185U JP3058185U JPS61146960U JP S61146960 U JPS61146960 U JP S61146960U JP 3058185 U JP3058185 U JP 3058185U JP 3058185 U JP3058185 U JP 3058185U JP S61146960 U JPS61146960 U JP S61146960U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat sink
- fixed
- chip
- circuit chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の集積回路装置の断面図である。 １……放熱板、２……外部リード、３……断面
逆台形のチツプ台、４……集積回路チツプ、５…
…マウント材、６……封止樹脂。
従来の集積回路装置の断面図である。 １……放熱板、２……外部リード、３……断面
逆台形のチツプ台、４……集積回路チツプ、５…
…マウント材、６……封止樹脂。
Claims (1)
- 放熱板に集積回路チツプを固定し樹脂封止した
集積回路装置において、前記集積回路チツプは断
面が逆台形のチツプ台を介して前記放熱板に固定
されていることを特徴とする集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3058185U JPS61146960U (ja) | 1985-03-04 | 1985-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3058185U JPS61146960U (ja) | 1985-03-04 | 1985-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61146960U true JPS61146960U (ja) | 1986-09-10 |
Family
ID=30530408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3058185U Pending JPS61146960U (ja) | 1985-03-04 | 1985-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146960U (ja) |
-
1985
- 1985-03-04 JP JP3058185U patent/JPS61146960U/ja active Pending