JPS6251753U - - Google Patents
Info
- Publication number
- JPS6251753U JPS6251753U JP1985143740U JP14374085U JPS6251753U JP S6251753 U JPS6251753 U JP S6251753U JP 1985143740 U JP1985143740 U JP 1985143740U JP 14374085 U JP14374085 U JP 14374085U JP S6251753 U JPS6251753 U JP S6251753U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- resin
- metal support
- sealed
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図aは本考案の一実施例の封止樹脂の一部
を切欠いた平面図、同図bは図aのA―A断面図
、第2図は第1図の金属支持板と固着半導体チツ
プを示す断面図、第3図は本考案に係る金属支持
板の他の例と固着半導体チツプを示す断面図であ
る。 1,8……金属支持板、1a,8a……放熱体
部、2,3……外部リード、4……半導体チツプ
、5……接着剤、6……ボンデイングワイヤ、7
……封止樹脂。
を切欠いた平面図、同図bは図aのA―A断面図
、第2図は第1図の金属支持板と固着半導体チツ
プを示す断面図、第3図は本考案に係る金属支持
板の他の例と固着半導体チツプを示す断面図であ
る。 1,8……金属支持板、1a,8a……放熱体
部、2,3……外部リード、4……半導体チツプ
、5……接着剤、6……ボンデイングワイヤ、7
……封止樹脂。
Claims (1)
- 金属支持板に半導体チツプを固着し樹脂封止し
た樹脂封止型半導体装置において、前記金属支持
板チツプ固着部裏面には、この支持板と一体形成
または別個に取付けられた放熱ひだ付きの放熱体
部を備えていることを特徴とする樹脂封止型半導
体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985143740U JPS6251753U (ja) | 1985-09-19 | 1985-09-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985143740U JPS6251753U (ja) | 1985-09-19 | 1985-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6251753U true JPS6251753U (ja) | 1987-03-31 |
Family
ID=31053697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985143740U Pending JPS6251753U (ja) | 1985-09-19 | 1985-09-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6251753U (ja) |
-
1985
- 1985-09-19 JP JP1985143740U patent/JPS6251753U/ja active Pending