JPH02127038U - - Google Patents

Info

Publication number
JPH02127038U
JPH02127038U JP1989036061U JP3606189U JPH02127038U JP H02127038 U JPH02127038 U JP H02127038U JP 1989036061 U JP1989036061 U JP 1989036061U JP 3606189 U JP3606189 U JP 3606189U JP H02127038 U JPH02127038 U JP H02127038U
Authority
JP
Japan
Prior art keywords
resin
base
lid
semiconductor chip
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989036061U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989036061U priority Critical patent/JPH02127038U/ja
Publication of JPH02127038U publication Critical patent/JPH02127038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による樹脂封止サ
ーデイツプパツケージの断面図、第２図、第３図
はこの発明の他の実施例を示す同じく断面図、第
４図はこの発明の他の実施例を示す樹脂封止サー
デイツプパツケージの側面図、第５図は従来の樹
脂封止サーデイツプパツケージの断面図である。 図において、１は半導体チツプ、２はリード、
３は金線、４はベース、５はふた、６は封止樹脂
である。なお、図中、同一符号は同一、又は相当
部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプを固定するベースと、このベース
    と樹脂で接着し半導体チツプを封止するふたを備
    え、前記ふた、ベースの接着面に突起部を設け樹
    脂封止部の一部の樹脂厚を小さくしたことを特徴
    とする樹脂封止サーデイツプパツケージ。
JP1989036061U 1989-03-28 1989-03-28 Pending JPH02127038U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989036061U JPH02127038U (ja) 1989-03-28 1989-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989036061U JPH02127038U (ja) 1989-03-28 1989-03-28

Publications (1)

Publication Number Publication Date
JPH02127038U true JPH02127038U (ja) 1990-10-19

Family

ID=31541965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989036061U Pending JPH02127038U (ja) 1989-03-28 1989-03-28

Country Status (1)

Country Link
JP (1) JPH02127038U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011205270A (ja) * 2010-03-25 2011-10-13 Nippon Dempa Kogyo Co Ltd 圧電デバイス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011205270A (ja) * 2010-03-25 2011-10-13 Nippon Dempa Kogyo Co Ltd 圧電デバイス
US8624470B2 (en) 2010-03-25 2014-01-07 Nihon Dempa Kogyo Co., Ltd. Piezoelectric devices including electrode-less vibrating portions

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