JPS61102048U - - Google Patents
Info
- Publication number
- JPS61102048U JPS61102048U JP1984187130U JP18713084U JPS61102048U JP S61102048 U JPS61102048 U JP S61102048U JP 1984187130 U JP1984187130 U JP 1984187130U JP 18713084 U JP18713084 U JP 18713084U JP S61102048 U JPS61102048 U JP S61102048U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- heat sink
- resin
- thin
- partially
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の断面図、第２図お
よび第３図はそれぞれ従来例の一実施例および他
の従来例の断面図である。 １，１１……リードフレーム放熱板、１ａ……
放熱板凸出部、２……半導体チツプ、３，４……
封止樹脂。
よび第３図はそれぞれ従来例の一実施例および他
の従来例の断面図である。 １，１１……リードフレーム放熱板、１ａ……
放熱板凸出部、２……半導体チツプ、３，４……
封止樹脂。
Claims (1)
- 半導体チツプを搭載した放熱板全体を前記半導
体チツプと共に樹脂で包覆してなる絶縁型樹脂封
止半導体装置において、前記放熱板の前記半導体
チツプ搭載部の反対側の面が部分的に凸出面とさ
れ、この部分で前記封止樹脂が薄くないているこ
とを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984187130U JPH0334913Y2 (ja) | 1984-12-10 | 1984-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984187130U JPH0334913Y2 (ja) | 1984-12-10 | 1984-12-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61102048U true JPS61102048U (ja) | 1986-06-28 |
| JPH0334913Y2 JPH0334913Y2 (ja) | 1991-07-24 |
Family
ID=30744595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984187130U Expired JPH0334913Y2 (ja) | 1984-12-10 | 1984-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334913Y2 (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57175448U (ja) * | 1981-04-30 | 1982-11-05 |
-
1984
- 1984-12-10 JP JP1984187130U patent/JPH0334913Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57175448U (ja) * | 1981-04-30 | 1982-11-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334913Y2 (ja) | 1991-07-24 |