JPS6234441U - - Google Patents

Info

Publication number
JPS6234441U
JPS6234441U JP12533985U JP12533985U JPS6234441U JP S6234441 U JPS6234441 U JP S6234441U JP 12533985 U JP12533985 U JP 12533985U JP 12533985 U JP12533985 U JP 12533985U JP S6234441 U JPS6234441 U JP S6234441U
Authority
JP
Japan
Prior art keywords
element mounting
semiconductor device
semiconductor
resin
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12533985U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12533985U priority Critical patent/JPS6234441U/ja
Publication of JPS6234441U publication Critical patent/JPS6234441U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例を示す半導体装
置の概略縦断面図、第２図は従来の半導体装置の
概略縦断面図、第３図は本考案の第２の実施例を
示す半導体装置の概略縦断面図である。 １１……素子搭載部、１１ａ……素子搭載部の
露出部分、１２……リード（内部リード）、１３
……半導体素子、１５……樹脂部、１６……金属
突起。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体素子を固着した素子搭載部と、この素子
    搭載部の周囲に配設され前記半導体素子に接続さ
    れたリードとが、樹脂部で封止された半導体装置
    において、 前記素子搭載部の裏面の一部を前記樹脂部の底
    面から露出させ、その露出部分に、下方向に突出
    する金属突起を形成したことを特徴とする半導体
    装置。
JP12533985U 1985-08-15 1985-08-15 Pending JPS6234441U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12533985U JPS6234441U (ja) 1985-08-15 1985-08-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12533985U JPS6234441U (ja) 1985-08-15 1985-08-15

Publications (1)

Publication Number Publication Date
JPS6234441U true JPS6234441U (ja) 1987-02-28

Family

ID=31018154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12533985U Pending JPS6234441U (ja) 1985-08-15 1985-08-15

Country Status (1)

Country Link
JP (1) JPS6234441U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04369382A (ja) * 1991-06-14 1992-12-22 Hikari Dento Kogyosho:Yugen 表面処理加工を行った金属の乾燥方法
JP2004165646A (ja) * 2002-10-24 2004-06-10 Matsushita Electric Ind Co Ltd リードフレーム，樹脂封止型半導体装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04369382A (ja) * 1991-06-14 1992-12-22 Hikari Dento Kogyosho:Yugen 表面処理加工を行った金属の乾燥方法
JP2004165646A (ja) * 2002-10-24 2004-06-10 Matsushita Electric Ind Co Ltd リードフレーム，樹脂封止型半導体装置及びその製造方法

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