JPS6232534U - - Google Patents

Info

Publication number
JPS6232534U
JPS6232534U JP1985123873U JP12387385U JPS6232534U JP S6232534 U JPS6232534 U JP S6232534U JP 1985123873 U JP1985123873 U JP 1985123873U JP 12387385 U JP12387385 U JP 12387385U JP S6232534 U JPS6232534 U JP S6232534U
Authority
JP
Japan
Prior art keywords
die
circuit board
recess
die land
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985123873U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985123873U priority Critical patent/JPS6232534U/ja
Publication of JPS6232534U publication Critical patent/JPS6232534U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の実施例を示す半導体ペレツ
トが仮想線で表示された混成集積回路の要部斜視
図、第２図は第１図のＡ―Ａ線断面図、第３図と
第４図は他の実施例を示す回路基板の要部斜視図
、第５図は混成集積回路の従来例を示す半導体ペ
レツトが仮想線で表示された要部斜視図、第６図
は第１図のＢ―Ｂ線断面図である。 １１……回路基板、１２……半導体ペレツト、
１３……ダイランド、１４……接着剤、１７……
凹部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板上に設けられたダイランドに半導体ペ
    レツトをダイボンドしてなる混成集積回路装置に
    おいて、ダイランドの周縁部を除く一部に凹部を
    形成してなることを特徴とする混成集積回路装置
    。
JP1985123873U 1985-08-12 1985-08-12 Pending JPS6232534U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985123873U JPS6232534U (ja) 1985-08-12 1985-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985123873U JPS6232534U (ja) 1985-08-12 1985-08-12

Publications (1)

Publication Number Publication Date
JPS6232534U true JPS6232534U (ja) 1987-02-26

Family

ID=31015374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985123873U Pending JPS6232534U (ja) 1985-08-12 1985-08-12

Country Status (1)

Country Link
JP (1) JPS6232534U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181166A (ja) * 1994-12-22 1996-07-12 Ibiden Co Ltd プリント配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854642A (ja) * 1981-09-28 1983-03-31 Nec Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854642A (ja) * 1981-09-28 1983-03-31 Nec Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181166A (ja) * 1994-12-22 1996-07-12 Ibiden Co Ltd プリント配線板

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