JP2013046072A - 発光素子パッケージ、光源モジュール及びこれを含む照明システム - Google Patents
発光素子パッケージ、光源モジュール及びこれを含む照明システム Download PDFInfo
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- JP2013046072A JP2013046072A JP2012183660A JP2012183660A JP2013046072A JP 2013046072 A JP2013046072 A JP 2013046072A JP 2012183660 A JP2012183660 A JP 2012183660A JP 2012183660 A JP2012183660 A JP 2012183660A JP 2013046072 A JP2013046072 A JP 2013046072A
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- light emitting
- emitting device
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- Led Device Packages (AREA)
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】本発明の一実施例に係る発光素子パッケージは、壁部及び底面を有するキャビティを有するパッケージ本体と、前記キャビティ内に位置する発光素子と、前記パッケージ本体内に挿入され、前記発光素子の下部に位置する放熱部と、前記放熱部の周囲に位置し、ワイヤボンディングによって前記発光素子と電気的に連結される第2の電極パターンとを備え、前記第2の電極パターンは、ワイヤがボンディングされる第1の領域と、前記第1の領域と連結された第2の領域とを有し、前記第1の領域の幅と前記第2の領域の幅が互いに異なる。
【選択図】図13A
Description
210 パッケージ本体
220 放熱部
230 発光素子
240 モールディング部
Claims (17)
- 壁部及び底面を有するキャビティを有するパッケージ本体と、
前記キャビティ内に位置する発光素子と、
前記パッケージ本体の内に挿入され、前記発光素子の下部に位置する放熱部と、
前記放熱部の周囲に位置し、ワイヤボンディングによって前記発光素子と電気的に連結される第2の電極パターンと
を備え、
前記第2の電極パターンは、ワイヤがボンディングされる第1の領域と、前記第1の領域と連結された第2の領域とを有し、
前記第1の領域の幅と前記第2の領域の幅が互いに異なる、発光素子パッケージ。 - 前記パッケージ本体はセラミック材質からなる、請求項1に記載の発光素子パッケージ。
- 前記第1の領域の幅は前記第2の領域の幅より広い、請求項1又は2に記載の発光素子パッケージ。
- 前記パッケージ本体は複数の層からなり、前記第2の電極パターンは拡張パターンを含み、前記拡張パターンは、前記パッケージ本体をなす複数の層のうち少なくとも一つの層を貫通する少なくとも一つのビアホールと電気的に連結される、請求項1〜3のいずれかに記載の発光素子パッケージ。
- 前記ビアホールは、前記パッケージ本体の下部に配置される電極パッドと電気的に接触する、請求項4に記載の発光素子パッケージ。
- 前記ビアホールは、前記第2の電極パターンと電気的に連結され、前記キャビティの壁部と垂直方向に重畳される、請求項4又は5に記載の発光素子パッケージ。
- 前記拡張パターンは、前記第2の電極パターンから前記キャビティの壁部方向に拡張されて形成され、少なくとも一部は前記キャビティの壁部の下側に位置する、請求項4〜6のいずれかに記載の発光素子パッケージ。
- 前記発光素子パッケージは複数の発光素子を含み、前記放熱部は複数の発光素子にそれぞれ対応するように複数配置される、請求項1〜7のいずれかに記載の発光素子パッケージ。
- 前記放熱部と前記発光素子との間に位置し、セラミック材質からなる支持プレートをさらに含む、請求項1〜8のいずれかに記載の発光素子パッケージ。
- 前記パッケージ本体と前記発光素子との間に第1の電極パターンが位置する、請求項1〜9のいずれかに記載の発光素子パッケージ。
- 前記第1の電極パターンは、チップ実装領域と、前記チップ実装領域の周囲に配置される複数の縁部領域とを有し、隣接した各縁部領域間で前記パッケージ本体が露出する、請求項10に記載の発光素子パッケージ。
- 前記複数の縁部領域は前記チップ実装領域のコーナーに位置する、請求項11に記載の発光素子パッケージ。
- 前記複数の縁部領域は前記チップ実装領域の辺に沿って位置する、請求項11に記載の発光素子パッケージ。
- 前記支持プレートを貫通するビアホールが配置され、前記支持プレートのビアホールと前記第1の電極パターンとが電気的に連結される、請求項10〜13のいずれかに記載の発光素子パッケージ。
- 前記放熱部の底面に位置する支持プレートをさらに備える、請求項1〜14のいずれかに記載の発光素子パッケージ。
- 前記パッケージ本体のキャビティ内に位置する透光層をさらに備える、請求項1〜15のいずれかに記載の発光素子パッケージ。
- 前記発光素子から放出される光は260〜405nmの波長の範囲に属する、請求項1〜16のいずれかに記載の発光素子パッケージ。
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KR1020110084718A KR20130022053A (ko) | 2011-08-24 | 2011-08-24 | 발광소자 패키지, 발광소자 패키지 제조방법, 라이트 유닛, 표시장치 |
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US9964270B2 (en) | 2013-12-20 | 2018-05-08 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and adaptive headlight for a motor vehicle |
KR101738980B1 (ko) | 2015-02-05 | 2017-05-24 | 주식회사 루멘스 | 발광 모듈 및 조명 장치 |
JP2019514226A (ja) * | 2016-04-22 | 2019-05-30 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | 多層キャリアシステム、多層キャリアシステムの製造方法及び多層キャリアシステムの使用方法 |
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JP7132446B2 (ja) | 2019-03-29 | 2022-09-06 | ルミレッズ リミテッド ライアビリティ カンパニー | 埋込バックプレーンを有するファンアウト発光ダイオード(led)デバイス基板、照明システム及び製造方法 |
JP2021192422A (ja) * | 2020-04-02 | 2021-12-16 | 日亜化学工業株式会社 | 面状光源及びその製造方法 |
JP7244771B2 (ja) | 2020-04-02 | 2023-03-23 | 日亜化学工業株式会社 | 面状光源の製造方法 |
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EP2562832A3 (en) | 2016-03-16 |
US8773006B2 (en) | 2014-07-08 |
US20130049563A1 (en) | 2013-02-28 |
JP2017126803A (ja) | 2017-07-20 |
CN103078033B (zh) | 2018-04-13 |
JP6312899B2 (ja) | 2018-04-18 |
EP2562832B1 (en) | 2019-12-18 |
CN103078033A (zh) | 2013-05-01 |
EP2562832A2 (en) | 2013-02-27 |
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