JP2019514226A - 多層キャリアシステム、多層キャリアシステムの製造方法及び多層キャリアシステムの使用方法 - Google Patents
多層キャリアシステム、多層キャリアシステムの製造方法及び多層キャリアシステムの使用方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 340
- 239000000919 ceramic Substances 0.000 claims abstract description 195
- 239000011159 matrix material Substances 0.000 claims abstract description 52
- 239000004065 semiconductor Substances 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims description 72
- 239000004020 conductor Substances 0.000 claims description 45
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000005245 sintering Methods 0.000 claims description 12
- 238000003491 array Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910017107 AlOx Inorganic materials 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 17
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 5
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052777 Praseodymium Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明は、さらに、多層キャリアシステムの製造方法並びに多層キャリアシステムの使用方法に関する。
特に、熱伝導ペーストは熱的な接続としてのみ働く。
配線基板5は基板3を取り囲む。有利には、基板3は、少なくともその端面において完全に配線基板5によって取り囲まれている。
冷却力は従って向上されることができる。
1a 個別LED/熱生成半導体素子
1b LEDアレイ/熱生成半導体素子
2,2’、2” 多層セラミック基板
3,3’、3” 基材
4,4” 冷却体
4a 冷却フィン
5 配線基板
5a 空所
6a 熱伝導材料/はんだペースト/焼結ペースト
6b、6b’、6b” 熱伝導材料/熱伝導ペースト
7 マトリクスモジュール
8 貫通コンタクト/ビア
9 キャリア
11a p−接続領域
11b n−接続領域
10 キャリアシステム
20 多層個別配線
21 コンタクト領域
22 ESD構造
23 配線
24 プラグコンタクト
25 コンタクト
26 プラグ接続/ボンド配線
200,200’ 頂部コンタクト
201 ビア/貫通コンタクト
202 内部電極/導体路
220 ESD電極面
221 接地電極
300 ドライバコンセプト
301 象限
302 括弧
303 ドライバ
304 コンバータ
305 マイクロコントローラ
Claims (20)
- 多層キャリアシステムであって、
少なくとも1つの多層セラミック基板と、
熱生成半導体素子の少なくとも1つのマトリクスモジュールと、を備え、
前記半導体素子は前記多層セラミック基板上に配置され、
前記マトリクスモジュールは前記多層セラミック基板を介してドライバ回路と導電的に接続されている、
多層キャリアシステム。 - 前記少なくとも1つのマトリクスモジュールは、複数の個別LED及び/又はLEDアレイを有するLEDマトリクスを備える、
請求項1記載の多層キャリアシステム。 - 当該多層キャリアシステムは、前記マトリクスモジュールの前記半導体素子を個別に駆動制御するように構成されている、
請求項1又は2記載の多層キャリアシステム。 - 前記多層セラミック基板は、半導体素子の個別制御のために集積された多層個別配線を備える、
請求項1乃至3いずれか1項記載の多層キャリアシステム。 - 前記多層セラミック基板はバリスタセラミックを備える、
請求項1乃至4いずれか1項記載の多層キャリアシステム。 - 前記多層セラミック基板は複数の内部電極と貫通コンタクトとを備え、
前記内部電極は、前記多層セラミック基板のバリスタ層間に配置され、前記貫通コンタクトと導電的に接続されている、
請求項5記載の多層キャリアシステム。 - 前記多層セラミック基板は集積ESD基板を備える、
請求項1乃至6いずれか1項記載の多層キャリアシステム。 - 前記ドライバ回路は前記多層セラミック基板の表面上に直接取り付けられている、
請求項1乃至7いずれか1項記載の多層キャリアシステム。 - 当該多層キャリアシステムは、
基材をさらに備え、
前記多層セラミック基板は前記基材上に配置されており、
前記ドライバ回路は前記基材の表面上に直接取り付けられている、
請求項1乃至7いずれか1項記載の多層キャリアシステム。 - 当該多層キャリアシステムは、
基材と配線基板とをさらに備え、
前記配線基板は前記基材を少なくとも部分的に取り囲み、
前記ドライバ回路は前記配線基板の表面上に直接構築されている、
請求項1乃至7いずれか1項記載の多層キャリアシステム。 - 前記基材は、AlN又はAlOxを含むか、又は
前記基材は、IMS基板、金属コア配線基板、又はさらなる多層セラミック基板を含む、
請求項9又は10記載の多層キャリアシステム。 - 前記少なくとも1つのマトリクスモジュールは、それぞれm×n個の半導体素子を有する少なくとも4つの発光モジュールを有し、
m≧2及びn≧2である、
請求項1乃至11いずれか1項記載の多層キャリアシステム。 - 当該多層キャリアシステムは、
冷却体を備え、
前記冷却体は前記多層セラミック基板又は基材と熱的に接続されている、
請求項1、9又は10記載の多層キャリアシステム。 - 多層キャリアシステムを製造する方法であって、
集積された導体路、ESD構造、及び貫通コンタクトを有する多層セラミック基板を製造するステップと、
基材を用意し、前記基材上に前記多層セラミック基板を配置するステップと、
熱生成半導体素子の少なくとも1つのマトリクスモジュールを前記多層セラミック基板の表面上に配置するステップと、
前記多層セラミック基板、マトリクスモジュール、及び基材のアレンジメントをはんだ付け又はAg焼結により接続するステップと、
前記半導体素子を導体路及び貫通コンタクトを介して駆動制御するためにドライバ素子を用意するステップと、
前記基材を冷却体と熱的に接続するステップと、
を含む方法。 - 前記ドライバ素子は前記基材上に配置される、
請求項14記載の方法。 - さらなるステップにおいて、配線基板が用意され、
前記配線基板は、前記配線基板を貫通する空所を備え、
前記基材は、前記空所内に設置され、前記配線基板と導電的に接続される、
請求項14記載の方法。 - 前記ドライバ素子は前記配線基板上に配置される、
請求項16記載の方法。 - 前記多層セラミック基板の製造のためにグリーンシートを用意し、
前記グリーンシートに前記導体路を形成するための電極構造をプリントし、
前記グリーンシートに前記貫通コンタクトを形成するための空所を設ける、
請求項14乃至17いずれか1項記載の方法。 - 請求項1乃至13いずれか1項による多層キャリアシステムを使用する方法。
- 前記多層キャリアシステムは自動車分野におけるマトリクスLEDヘッドライトに使用される、
請求項19記載の方法。
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DE102016107495.0 | 2016-04-22 | ||
PCT/EP2017/053519 WO2017182159A1 (de) | 2016-04-22 | 2017-02-16 | Vielschicht-trägersystem, verfahren zur herstellung eines vielschicht-trägersystems und verwendung eines vielschicht-trägersystems |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021158874A1 (en) * | 2020-02-06 | 2021-08-12 | Lumileds Llc | Light-emitting device with metal inlay and bottom contacts |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017119346A1 (de) * | 2017-08-24 | 2019-02-28 | Osram Opto Semiconductors Gmbh | Bauteil mit Pufferschicht und Verfahren zur Herstellung eines Bauteils |
DE102017119344A1 (de) * | 2017-08-24 | 2019-02-28 | Osram Opto Semiconductors Gmbh | Träger und Bauteil mit Pufferschicht sowie Verfahren zur Herstellung eines Bauteils |
EP3876667A3 (de) * | 2020-03-03 | 2021-09-22 | Volker Fischer | Strahlungsheizung |
TWI736183B (zh) * | 2020-03-18 | 2021-08-11 | 飛宏科技股份有限公司 | 結合散熱器的碳化矽模組 |
WO2022020474A1 (en) * | 2020-07-21 | 2022-01-27 | Lumileds Llc | Light-emitting device with metal inlay and top contacts |
US11575074B2 (en) * | 2020-07-21 | 2023-02-07 | Lumileds Llc | Light-emitting device with metal inlay and top contacts |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005244220A (ja) * | 2004-02-25 | 2005-09-08 | Lumileds Lighting Us Llc | 基体にesd保護を組み入れた発光ダイオード用基体 |
JP2011124333A (ja) * | 2009-12-09 | 2011-06-23 | Tdk Corp | Led実装用基板 |
WO2011101771A1 (en) * | 2010-02-22 | 2011-08-25 | Koninklijke Philips Electronics N.V. | Adaptive lighting system with iii-nitride light emitting devices |
JP2013046072A (ja) * | 2011-08-22 | 2013-03-04 | Lg Innotek Co Ltd | 発光素子パッケージ、光源モジュール及びこれを含む照明システム |
JP2015527695A (ja) * | 2012-06-27 | 2015-09-17 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 照明デバイス、照明デバイスを備えた照明装置、および照明デバイスの動作方法 |
US20160093786A1 (en) * | 2014-09-30 | 2016-03-31 | Nichia Corporation | Light source, method for manufacturing the light source, and method for mounting the light source |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0823145A (ja) * | 1994-07-06 | 1996-01-23 | Mitsubishi Materials Corp | ハイブリッドic用基板 |
DE102005033709B4 (de) | 2005-03-16 | 2021-12-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Lichtemittierendes Modul |
DE102005054955A1 (de) | 2005-08-31 | 2007-04-26 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Modul, insbesondere zur Verwendung in einem optischen Projektionsgerät und optisches Projektionsgerät |
TW200917518A (en) * | 2007-10-05 | 2009-04-16 | Delta Electronics Inc | Co-fired ceramic module |
US8049237B2 (en) * | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
DE102008024479A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
DE102008024480A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
DE102009014542B3 (de) * | 2009-02-12 | 2010-12-02 | Epcos Ag | Mehrschichtbauelement und Verfahren zur Herstellung |
US9743521B2 (en) * | 2009-09-17 | 2017-08-22 | Philips Lighting Holding B.V. | Light-source module and light-emitting device |
EP2437581A1 (de) * | 2010-09-30 | 2012-04-04 | Odelo GmbH | Leuchtdiode auf Keramiksubstratbasis |
DE102011107895B4 (de) * | 2011-07-18 | 2020-11-05 | Heraeus Noblelight Gmbh | Optoelektronisches Modul mit Linsensystem |
DE102012104494A1 (de) * | 2012-05-24 | 2013-11-28 | Epcos Ag | Leuchtdiodenvorrichtung |
JP5914826B2 (ja) * | 2012-11-20 | 2016-05-11 | パナソニックIpマネジメント株式会社 | 発光モジュール、照明装置および照明器具 |
US9406654B2 (en) * | 2014-01-27 | 2016-08-02 | Ledengin, Inc. | Package for high-power LED devices |
-
2016
- 2016-04-22 DE DE102016107495.0A patent/DE102016107495B4/de active Active
-
2017
- 2017-02-16 WO PCT/EP2017/053519 patent/WO2017182159A1/de active Application Filing
- 2017-02-16 US US16/095,636 patent/US20190131208A1/en not_active Abandoned
- 2017-02-16 JP JP2018555272A patent/JP6778274B2/ja active Active
- 2017-03-31 TW TW106111067A patent/TWI730077B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005244220A (ja) * | 2004-02-25 | 2005-09-08 | Lumileds Lighting Us Llc | 基体にesd保護を組み入れた発光ダイオード用基体 |
JP2011124333A (ja) * | 2009-12-09 | 2011-06-23 | Tdk Corp | Led実装用基板 |
WO2011101771A1 (en) * | 2010-02-22 | 2011-08-25 | Koninklijke Philips Electronics N.V. | Adaptive lighting system with iii-nitride light emitting devices |
JP2013046072A (ja) * | 2011-08-22 | 2013-03-04 | Lg Innotek Co Ltd | 発光素子パッケージ、光源モジュール及びこれを含む照明システム |
JP2015527695A (ja) * | 2012-06-27 | 2015-09-17 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 照明デバイス、照明デバイスを備えた照明装置、および照明デバイスの動作方法 |
US20160093786A1 (en) * | 2014-09-30 | 2016-03-31 | Nichia Corporation | Light source, method for manufacturing the light source, and method for mounting the light source |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021158874A1 (en) * | 2020-02-06 | 2021-08-12 | Lumileds Llc | Light-emitting device with metal inlay and bottom contacts |
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US20190131208A1 (en) | 2019-05-02 |
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WO2017182159A1 (de) | 2017-10-26 |
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