JP2005244220A - 基体にesd保護を組み入れた発光ダイオード用基体 - Google Patents
基体にesd保護を組み入れた発光ダイオード用基体 Download PDFInfo
- Publication number
- JP2005244220A JP2005244220A JP2005042144A JP2005042144A JP2005244220A JP 2005244220 A JP2005244220 A JP 2005244220A JP 2005042144 A JP2005042144 A JP 2005042144A JP 2005042144 A JP2005042144 A JP 2005042144A JP 2005244220 A JP2005244220 A JP 2005244220A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- varistor
- metal
- ceramic
- zinc oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 98
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 84
- 239000011787 zinc oxide Substances 0.000 claims abstract description 42
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 22
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 22
- 229910052582 BN Inorganic materials 0.000 claims abstract description 19
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 19
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 19
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 107
- 229910052751 metal Inorganic materials 0.000 claims description 84
- 239000002184 metal Substances 0.000 claims description 84
- 239000010410 layer Substances 0.000 claims description 65
- 239000002245 particle Substances 0.000 claims description 24
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000002356 single layer Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical group [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
- H01C7/108—Metal oxide
- H01C7/112—ZnO type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Thermistors And Varistors (AREA)
Abstract
【解決手段】 バリスタを形成していないセラミック基体の部分は、酸化アルミニウム、窒化アルミニウム、炭化ケイ素、または窒化ホウ素であることができる。バリスタ部分は、セラミック基体の何れかの部分(セラミック基体の全てを含む)であることができる。
【選択図】 図3
Description
12 LEDチップ
14 パッド
16 セラミック基体
18 相互接続部材
20 バイア
22 下側パッド
23 エポキシ
24 ZnO粒子
26 バインダ
28 電極
30 LEDパッケージ
32 基体
34 酸化亜鉛
36 金属層(電極)
40 セラミック基体
42 バイア
50 バリスタ
52 酸化亜鉛
54 金属層
56 金属化部材
60 LEDチップ
62 ワイヤー
63 ダイ取付用エポキシ
64 反射器
66 レンズ
70、76 バリスタ
72、74 セラミック基体
78、80 金属層
84、86 金属層
90 バリスタ
92 金属層
Claims (21)
- 上面及び下面を有するセラミック基体であって、上記上面は、上記上面の上に位置する半導体デバイスの電極に電気的に接続される少なくとも1つの金属電極を有し、上記セラミック基体は、上記セラミック基体の上面に取付けられた半導体デバイスを静電気放電(ESD)から保護する金属酸化物バリスタを含むことを特徴とするセラミックデバイス。
- 上記バリスタは酸化亜鉛を含み、上記酸化亜鉛は、上記セラミック基体の中央部分だけを形成していることを特徴とする請求項1に記載のセラミック基体。
- 上記バリスタは酸化亜鉛を含み、上記酸化亜鉛は、上記セラミック基体の周縁の少なくとも一部分の周りだけに配置されていることを特徴とする請求項1に記載のセラミック基体。
- 上記バリスタは酸化亜鉛を含み、上記酸化亜鉛は、上記バリスタを形成していない上記セラミック基体の上面または下面の少なくとも一部分上に配置されていることを特徴とする請求項1に記載のセラミック基体。
- 上記バリスタは酸化亜鉛を含み、上記酸化亜鉛は、上記セラミック基体内の材料の大部分を構成していることを特徴とする請求項1に記載のセラミック基体。
- バリスタではない上記セラミック基体の一部分は、酸化アルミニウム、窒化アルミニウム、炭化ケイ素、または窒化ホウ素の1つからなり、上記バリスタは酸化亜鉛を含むことを特徴とする請求項1に記載のセラミック基体。
- 上記バリスタはセラミック粒子を含み、上記バリスタは上記セラミック粒子を挟む複数の金属層を含み、上記金属層は露出された基体電極に電気的に接続され、上記セラミック粒子は、上記金属層にまたがってESD電圧が印加された時に上記金属層の間に低抵抗路を発生するようになっていることを特徴とする請求項1に記載のセラミック基体。
- 上記バリスタはセラミック粒子を含み、上記バリスタは複数の重なり合った金属層を更に含み、上記セラミック粒子は上記金属層の間に配置され、上記金属層は上記基体上の金属電極に電気的に接続されていることを特徴とする請求項1に記載のセラミック基体。
- 上記バリスタは1つの表面を形成しているセラミック粒子を含み、上記バリスタは露出された基体電極に電気的に接続されている複数の金属層を含み、上記複数の金属層は上記セラミック粒子の単一の表面とだけ物理的に接触しており、上記セラミック粒子は上記金属層にまたがってESD電圧が印加された時に上記金属層の間に低抵抗路を発生するようになっていることを特徴とする請求項1に記載のセラミック基体。
- 上記基体の上面に取付けられ、且つ上記バリスタによってESDから保護されている発光ダイオード(LED)チップを更に含むことを特徴とする請求項1に記載のセラミック基体。
- 上記バリスタは、上記半導体デバイスと、上記基体を取付けている印刷回路基板との間の熱伝導路の一部を形成していることを特徴とする請求項1に記載のセラミック基体。
- 上記セラミック基体は上面及び下面を有し且つ酸化アルミニウム、窒化アルミニウム、炭化ケイ素、または窒化ホウ素の1つからなり、上記バリスタは上記セラミック基体の上面または下面に固定された1またはそれ以上の層として形成されている酸化亜鉛を含み、第1の金属層が上記1またはそれ以上の層の上面に物理的に接触するように形成され、第2の金属層が上記1またはそれ以上の層の下面に物理的に接触するように形成されており、上記1またはそれ以上の層は上記第1の金属層と上記第2の金属層とにまたがってESD電圧が印加された時に上記第1の金属層と上記第2の金属層との間に低抵抗路を発生するようになっていることを特徴とする請求項1に記載のセラミック基体。
- 上記セラミック基体は上面及び下面を有し且つ酸化アルミニウム、窒化アルミニウム、炭化ケイ素、または窒化ホウ素の1つからなり、上記バリスタは上記セラミック基体の上面または下面に固定された単一の層として形成されている酸化亜鉛を含み、第1の金属層が上記単一の層の第1の表面に物理的に接触するように形成され、第2の金属層がこれもまた上記単一の表面に物理的に接触するように形成されており、上記単一の層は上記第1の金属層と上記第2の金属層とにまたがってESD電圧が印加された時に上記第1の金属層と上記第2の金属層との間に低抵抗路を発生するようになっていることを特徴とする請求項1に記載のセラミック基体。
- 上記半導体デバイスに接続される金属パッドと、印刷回路基板に電気的に接続される金属電極とを更に含み、上記金属パッド及び上記金属電極は上記セラミック基体の上面に配置されていることを特徴とする請求項1に記載のセラミック基体。
- 上記金属パッドを上記金属電極に電気的に接続するために、上記セラミック基体を貫通している金属バイアを更に含むことを特徴とする請求項14に記載のセラミック基体。
- 上記金属パッドは、上記セラミック基体の周縁上の金属部分によって上記金属電極に電気的に接続されることを特徴とする請求項14に記載のセラミック基体。
- 上記半導体デバイスは、上記セラミック基体の上面に直接固定されている半導体チップを含むことを特徴とする請求項1に記載のセラミック基体。
- 半導体デバイスを静電気放電(ESD)から保護するようにセラミック基体を形成する方法であって、
上面及び下面を有するセラミック基体を形成させるステップと、
上記セラミック基体の上面上に少なくとも1つの金属電極を形成させ、上記金属電極を上記金属電極の上に配置される半導体デバイスの電極に電気的に接続するステップと、
を含み、
上記セラミック基体は、上記セラミック基体の上面上に取付けられた半導体デバイスを静電気放電(ESD)から保護する金属酸化物バリスタを含む、
ことを特徴とする方法。 - 上記バリスタは、酸化亜鉛を含むことを特徴とする請求項18に記載の方法。
- 上記セラミック基体の一部分は上記バリスタの部分を形成しておらず、上記バリスタの部分を形成していない上記セラミック基体の一部分は、酸化アルミニウム、窒化アルミニウム、炭化ケイ素、または窒化ホウ素の1つからなることを特徴とする請求項19に記載の方法。
- 上記セラミック基体の一部分は上記バリスタの部分を形成しておらず、上記バリスタの部分を形成していない上記セラミック基体の一部分は、酸化アルミニウム、窒化アルミニウム、炭化ケイ素、または窒化ホウ素の1つからなることを特徴とする請求項18に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/787657 | 2004-02-25 | ||
US10/787,657 US7279724B2 (en) | 2004-02-25 | 2004-02-25 | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005244220A true JP2005244220A (ja) | 2005-09-08 |
JP5698424B2 JP5698424B2 (ja) | 2015-04-08 |
Family
ID=34861924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005042144A Active JP5698424B2 (ja) | 2004-02-25 | 2005-02-18 | 基体にesd保護を組み入れた発光ダイオード用基体 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7279724B2 (ja) |
EP (1) | EP1580809B1 (ja) |
JP (1) | JP5698424B2 (ja) |
TW (1) | TWI377692B (ja) |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339559A (ja) * | 2005-06-06 | 2006-12-14 | Matsushita Electric Ind Co Ltd | Led部品およびその製造方法 |
KR100674857B1 (ko) | 2005-07-04 | 2007-01-29 | 삼성전기주식회사 | 정전기 방전(esd)을 강화한 엘이디 패키지 및 그제조방법 |
JP2007088173A (ja) * | 2005-09-21 | 2007-04-05 | Tdk Corp | 積層型チップバリスタ及び電子機器の製造方法 |
JP2007227882A (ja) * | 2006-02-23 | 2007-09-06 | Novalite Optronics Corp | 発光ダイオードパッケージとその製造方法 |
JP2007266097A (ja) * | 2006-03-27 | 2007-10-11 | Tdk Corp | バリスタ及び発光装置 |
JP2008028029A (ja) * | 2006-07-19 | 2008-02-07 | Tdk Corp | バリスタ及び発光装置 |
JP2008252150A (ja) * | 2008-07-22 | 2008-10-16 | Tdk Corp | 積層型チップバリスタ |
WO2008129877A1 (ja) * | 2007-04-17 | 2008-10-30 | Panasonic Corporation | Led実装基板 |
JP2008263236A (ja) * | 2008-07-22 | 2008-10-30 | Tdk Corp | 電子機器 |
JP2008277716A (ja) * | 2007-03-30 | 2008-11-13 | Tdk Corp | バリスタ及び発光装置 |
JP2008283077A (ja) * | 2007-05-11 | 2008-11-20 | Tdk Corp | バリスタ及び発光装置 |
JP2009016616A (ja) * | 2007-07-05 | 2009-01-22 | Tdk Corp | サージ吸収素子及び発光装置 |
JP2011523776A (ja) * | 2008-05-21 | 2011-08-18 | エプコス アクチエンゲゼルシャフト | バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ |
JP2011524082A (ja) * | 2008-05-21 | 2011-08-25 | エプコス アクチエンゲゼルシャフト | バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ |
WO2011108227A1 (ja) * | 2010-03-01 | 2011-09-09 | パナソニック株式会社 | 発光素子用基板及びその製造方法ならびに発光装置 |
WO2012063459A1 (ja) * | 2010-11-08 | 2012-05-18 | パナソニック株式会社 | 発光ダイオードモジュールおよびそれに用いられるセラミック基板 |
WO2013027413A1 (ja) * | 2011-08-25 | 2013-02-28 | パナソニック株式会社 | 保護素子及びこれを用いた発光装置 |
KR101457207B1 (ko) | 2008-06-30 | 2014-11-03 | 서울바이오시스 주식회사 | 정전기 방전 보호소자가 구비된 발광 다이오드 |
US9136439B2 (en) | 2012-05-25 | 2015-09-15 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
JP2016537820A (ja) * | 2013-11-21 | 2016-12-01 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス半導体チップ |
JP2016213214A (ja) * | 2015-04-28 | 2016-12-15 | 日亜化学工業株式会社 | 発光素子 |
JP2019510377A (ja) * | 2016-03-24 | 2019-04-11 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | マルチledシステム |
JP2019514226A (ja) * | 2016-04-22 | 2019-05-30 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | 多層キャリアシステム、多層キャリアシステムの製造方法及び多層キャリアシステムの使用方法 |
CN110600918A (zh) * | 2018-06-13 | 2019-12-20 | 法雷奥照明公司 | 印刷电路板、卡缘连接器插座、电子组件和车辆照明装置 |
Families Citing this family (139)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7825491B2 (en) * | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
US20100038119A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
WO2001017320A1 (en) | 1999-08-27 | 2001-03-08 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US20100038121A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
US20100040896A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
CN100587560C (zh) | 2003-04-01 | 2010-02-03 | 夏普株式会社 | 发光装置用组件、发光装置、背侧光照射装置、显示装置 |
US7854535B2 (en) * | 2003-09-23 | 2010-12-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Ceramic packaging for high brightness LED devices |
US20080025030A9 (en) * | 2003-09-23 | 2008-01-31 | Lee Kong W | Ceramic packaging for high brightness LED devices |
KR20050034936A (ko) * | 2003-10-10 | 2005-04-15 | 삼성전기주식회사 | 형광체를 이용한 파장변환형 발광 다이오드 패키지 및제조방법 |
JP2006086274A (ja) * | 2004-09-15 | 2006-03-30 | Taiyo Yuden Co Ltd | 積層バリスタ,積層バリスタの実装構造及びバリスタモジュール |
JP2006086469A (ja) * | 2004-09-17 | 2006-03-30 | Matsushita Electric Ind Co Ltd | 半導体発光装置、照明モジュール、照明装置及び半導体発光装置の製造方法 |
US8679674B2 (en) | 2005-03-25 | 2014-03-25 | Front Edge Technology, Inc. | Battery with protective packaging |
US7846579B2 (en) | 2005-03-25 | 2010-12-07 | Victor Krasnov | Thin film battery with protective packaging |
US20070200133A1 (en) * | 2005-04-01 | 2007-08-30 | Akira Hashimoto | Led assembly and manufacturing method |
CN101156221B (zh) * | 2005-04-01 | 2012-02-08 | 松下电器产业株式会社 | 变阻器和使用该变阻器的电子部件模块 |
US7505239B2 (en) * | 2005-04-14 | 2009-03-17 | Tdk Corporation | Light emitting device |
US7348212B2 (en) * | 2005-09-13 | 2008-03-25 | Philips Lumileds Lighting Company Llc | Interconnects for semiconductor light emitting devices |
US7736945B2 (en) * | 2005-06-09 | 2010-06-15 | Philips Lumileds Lighting Company, Llc | LED assembly having maximum metal support for laser lift-off of growth substrate |
US20060289887A1 (en) * | 2005-06-24 | 2006-12-28 | Jabil Circuit, Inc. | Surface mount light emitting diode (LED) assembly with improved power dissipation |
JP2009502024A (ja) * | 2005-06-27 | 2009-01-22 | ラミナ ライティング インコーポレーテッド | 発光ダイオードパッケージ及びその製造方法 |
US20070015300A1 (en) * | 2005-07-15 | 2007-01-18 | Yu-Chuan Liu | Method for fabricating a light-emitting device |
KR100629521B1 (ko) * | 2005-07-29 | 2006-09-28 | 삼성전자주식회사 | Led 패키지 및 그 제조방법과 이를 이용한 led어레이 모듈 |
US7671468B2 (en) * | 2005-09-30 | 2010-03-02 | Tdk Corporation | Light emitting apparatus |
JP4146464B2 (ja) * | 2005-10-11 | 2008-09-10 | Tdk株式会社 | 発光装置 |
US7923844B2 (en) | 2005-11-22 | 2011-04-12 | Shocking Technologies, Inc. | Semiconductor devices including voltage switchable materials for over-voltage protection |
US20100264224A1 (en) * | 2005-11-22 | 2010-10-21 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
CN101578710B (zh) * | 2005-11-22 | 2013-05-22 | 肖克科技有限公司 | 使用电压可变介电材料的发光设备 |
US20070126020A1 (en) * | 2005-12-03 | 2007-06-07 | Cheng Lin | High-power LED chip packaging structure and fabrication method thereof |
US8030575B2 (en) * | 2005-12-29 | 2011-10-04 | Sensor Electronic Technology, Inc. | Mounting structure providing electrical surge protection |
WO2007081719A2 (en) | 2006-01-05 | 2007-07-19 | Illumitex, Inc. | Separate optical device for directing light from an led |
TWI303872B (en) * | 2006-03-13 | 2008-12-01 | Ind Tech Res Inst | High power light emitting device assembly with esd preotection ability and the method of manufacturing the same |
US9780268B2 (en) * | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
USD738832S1 (en) | 2006-04-04 | 2015-09-15 | Cree, Inc. | Light emitting diode (LED) package |
US7968010B2 (en) | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Method for electroplating a substrate |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
EP2067145A2 (en) * | 2006-09-24 | 2009-06-10 | Shocking Technologies, Inc. | Technique for plating substrate devices using voltage switchable dielectric material and light assistance |
JP2010521058A (ja) | 2006-09-24 | 2010-06-17 | ショッキング テクノロジーズ,インコーポレイテッド | ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法 |
WO2008038924A1 (en) * | 2006-09-28 | 2008-04-03 | Seoul Opto Device Co., Ltd. | Ultraviolet light emitting diode package |
KR100774218B1 (ko) * | 2006-09-28 | 2007-11-08 | 엘지전자 주식회사 | 렌즈, 그 제조방법 및 발광 소자 패키지 |
WO2008042351A2 (en) | 2006-10-02 | 2008-04-10 | Illumitex, Inc. | Led system and method |
KR100845856B1 (ko) * | 2006-12-21 | 2008-07-14 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
US7902564B2 (en) * | 2006-12-22 | 2011-03-08 | Koninklijke Philips Electronics N.V. | Multi-grain luminescent ceramics for light emitting devices |
KR100851183B1 (ko) * | 2006-12-27 | 2008-08-08 | 엘지이노텍 주식회사 | 반도체 발광소자 패키지 |
TWI342075B (en) * | 2007-01-08 | 2011-05-11 | Ledtech Electronics Corp | Ceramic package for led |
US20080169480A1 (en) * | 2007-01-11 | 2008-07-17 | Visera Technologies Company Limited | Optoelectronic device package and packaging method thereof |
US20080225449A1 (en) * | 2007-03-13 | 2008-09-18 | Tatsuya Inoue | Electrostatic discharge protection component, and electronic component module using the same |
US20080224815A1 (en) * | 2007-03-13 | 2008-09-18 | Tatsuya Inoue | Electrostatic discharge protection component, and electronic component module using the same |
US7932806B2 (en) | 2007-03-30 | 2011-04-26 | Tdk Corporation | Varistor and light emitting device |
EP1990834B1 (en) * | 2007-05-10 | 2012-08-15 | Texas Instruments France | Local integration of non-linear sheet in integrated circuit packages for ESD/EOS protection |
TW200849395A (en) * | 2007-06-01 | 2008-12-16 | Univ Chang Gung | Thin-film ZnO varistor and manufacturing method and application thereof |
US7911059B2 (en) * | 2007-06-08 | 2011-03-22 | SeniLEDS Optoelectronics Co., Ltd | High thermal conductivity substrate for a semiconductor device |
US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US20090050856A1 (en) * | 2007-08-20 | 2009-02-26 | Lex Kosowsky | Voltage switchable dielectric material incorporating modified high aspect ratio particles |
DE102007043681B4 (de) * | 2007-09-13 | 2022-01-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement |
DE102007044198A1 (de) * | 2007-09-17 | 2009-03-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Modul |
US20090143216A1 (en) * | 2007-12-03 | 2009-06-04 | General Electric Company | Composition and method |
CN101465347A (zh) * | 2007-12-17 | 2009-06-24 | 富士迈半导体精密工业(上海)有限公司 | 光源模组及其制造方法 |
US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
US7829358B2 (en) | 2008-02-08 | 2010-11-09 | Illumitex, Inc. | System and method for emitter layer shaping |
US20090220771A1 (en) * | 2008-02-12 | 2009-09-03 | Robert Fleming | Voltage switchable dielectric material with superior physical properties for structural applications |
US8310043B2 (en) * | 2008-03-25 | 2012-11-13 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader with ESD protection layer |
US8329510B2 (en) * | 2008-03-25 | 2012-12-11 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer |
JP5163228B2 (ja) * | 2008-03-28 | 2013-03-13 | Tdk株式会社 | バリスタ |
US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
DE102008024479A1 (de) | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
US8269408B2 (en) * | 2008-08-12 | 2012-09-18 | Helio Optoelectronics Corporation | LED base structure with embedded capacitor |
EP2342722A2 (en) | 2008-09-30 | 2011-07-13 | Shocking Technologies Inc | Voltage switchable dielectric material containing conductive core shelled particles |
US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
US7871842B2 (en) * | 2008-10-03 | 2011-01-18 | E. I. Du Pont De Nemours And Company | Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package |
US8362871B2 (en) | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
DE102008057174A1 (de) | 2008-11-13 | 2010-05-20 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbare Vorrichtung |
DE102009006177A1 (de) | 2008-11-28 | 2010-06-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
DE102008054923B4 (de) * | 2008-12-18 | 2018-04-26 | Infineon Technologies Ag | Leistungshalbleitermodul mit in Gehäusewand integriertem Kondensator hoher Kapazität |
US20100155021A1 (en) * | 2008-12-22 | 2010-06-24 | Chin Hsiang Chiang | Heat exchange cooling structure |
US20100157492A1 (en) * | 2008-12-23 | 2010-06-24 | General Electric Company | Electronic device and associated method |
US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
TWI413284B (zh) * | 2009-02-24 | 2013-10-21 | Ind Tech Res Inst | 發光二極體封裝結構 |
US8692274B2 (en) | 2009-02-24 | 2014-04-08 | Industrial Technology Research Institute | Light emitting diode package structure |
US8445917B2 (en) | 2009-03-20 | 2013-05-21 | Cree, Inc. | Bidirectional silicon carbide transient voltage suppression devices |
US8968606B2 (en) | 2009-03-26 | 2015-03-03 | Littelfuse, Inc. | Components having voltage switchable dielectric materials |
TWI467706B (zh) * | 2009-04-09 | 2015-01-01 | Ind Tech Res Inst | 陶瓷基板及其製造方法 |
US8629473B2 (en) * | 2009-08-13 | 2014-01-14 | Toyoda Gosei Co., Ltd. | Semiconductor light-emitting element, semiconductor light-emitting device, method for producing semiconductor light-emitting element, method for producing semiconductor light-emitting device, illumination device using semiconductor light-emitting device, and electronic apparatus |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
WO2011037876A1 (en) * | 2009-09-25 | 2011-03-31 | Cree, Inc. | Lighting device having heat dissipation element |
WO2011084252A2 (en) * | 2009-12-21 | 2011-07-14 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic dissipative articles and method of making |
US8286886B2 (en) * | 2009-12-23 | 2012-10-16 | Hynix Semiconductor Inc. | LED package and RFID system including the same |
KR20110080318A (ko) * | 2010-01-05 | 2011-07-13 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
US9224728B2 (en) | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
CN102201399B (zh) * | 2010-03-22 | 2016-04-13 | 晶元光电股份有限公司 | 发光元件 |
JP5403370B2 (ja) * | 2010-05-17 | 2014-01-29 | 株式会社村田製作所 | Esd保護装置 |
US8476659B2 (en) * | 2010-07-15 | 2013-07-02 | Tsmc Solid State Lighting Ltd. | Light emitting device |
US8304797B2 (en) * | 2010-07-29 | 2012-11-06 | Osram Sylvania Inc. | Light emitting diode light source having a ceramic substrate |
US8534901B2 (en) | 2010-09-13 | 2013-09-17 | Teledyne Reynolds, Inc. | Collimating waveguide apparatus and method |
WO2012035484A1 (en) | 2010-09-15 | 2012-03-22 | Koninklijke Philips Electronics N.V. | Embedded transient voltage suppression for light emitting devices |
WO2012103928A1 (en) * | 2011-01-31 | 2012-08-09 | Osram Opto Semiconductors Gmbh | Arrangement of carriers for optoelectronic chips |
WO2012128270A1 (ja) * | 2011-03-24 | 2012-09-27 | 株式会社村田製作所 | 発光素子用台座基板およびledデバイス |
US8608328B2 (en) | 2011-05-06 | 2013-12-17 | Teledyne Technologies Incorporated | Light source with secondary emitter conversion element |
TWI474522B (zh) * | 2011-05-12 | 2015-02-21 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
KR101241133B1 (ko) | 2011-06-29 | 2013-03-11 | (주) 아모엘이디 | 무수축 바리스터 기판, 무수축 바리스터 기판을 갖는 엘이디 패키지 및 무수축 바리스터 기판의 제조 방법 |
CN103650171B (zh) | 2011-07-15 | 2018-09-18 | 亮锐控股有限公司 | 将半导体装置结合到支持衬底的方法 |
US8865340B2 (en) | 2011-10-20 | 2014-10-21 | Front Edge Technology Inc. | Thin film battery packaging formed by localized heating |
WO2013062014A1 (ja) * | 2011-10-24 | 2013-05-02 | 日精エー・エス・ビー機械株式会社 | 射出ブロー成形装置及びそれに用いられる金型ユニット並びに射出ブロー成形方法 |
DE102012101606A1 (de) | 2011-10-28 | 2013-05-02 | Epcos Ag | ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED |
US9887429B2 (en) | 2011-12-21 | 2018-02-06 | Front Edge Technology Inc. | Laminated lithium battery |
US8864954B2 (en) | 2011-12-23 | 2014-10-21 | Front Edge Technology Inc. | Sputtering lithium-containing material with multiple targets |
US9077000B2 (en) | 2012-03-29 | 2015-07-07 | Front Edge Technology, Inc. | Thin film battery and localized heat treatment |
US9257695B2 (en) | 2012-03-29 | 2016-02-09 | Front Edge Technology, Inc. | Localized heat treatment of battery component films |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
DE102012104494A1 (de) * | 2012-05-24 | 2013-11-28 | Epcos Ag | Leuchtdiodenvorrichtung |
DE102012105619A1 (de) * | 2012-06-27 | 2014-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
KR101483259B1 (ko) * | 2012-08-28 | 2015-01-14 | 주식회사 아모센스 | 무수축 바리스타 기판 및 그 제조 방법 |
WO2014035143A1 (ko) * | 2012-08-28 | 2014-03-06 | ㈜ 아모엘이디 | 무수축 바리스타 기판 및 그 제조 방법 |
US9159964B2 (en) | 2012-09-25 | 2015-10-13 | Front Edge Technology, Inc. | Solid state battery having mismatched battery cells |
US8753724B2 (en) | 2012-09-26 | 2014-06-17 | Front Edge Technology Inc. | Plasma deposition on a partially formed battery through a mesh screen |
US9356320B2 (en) | 2012-10-15 | 2016-05-31 | Front Edge Technology Inc. | Lithium battery having low leakage anode |
WO2014092296A1 (ko) * | 2012-12-14 | 2014-06-19 | ㈜ 아모엘이디 | 방열 비아 형성 바리스터 기판 및 그 제조 방법 |
CN103456871B (zh) * | 2013-09-23 | 2016-05-25 | 电子科技大学 | 改善pc-LEDs空间光色度均匀性的荧光粉涂层结构 |
JP6355492B2 (ja) * | 2013-10-03 | 2018-07-11 | アルパッド株式会社 | 複合樹脂及び電子デバイス |
JP6539035B2 (ja) * | 2014-01-08 | 2019-07-03 | ローム株式会社 | チップ部品 |
CN103824846A (zh) * | 2014-03-13 | 2014-05-28 | 杭州明果教育咨询有限公司 | 一种多场效晶体管集成模块 |
DE102014115375A1 (de) | 2014-08-08 | 2016-02-11 | Epcos Ag | Träger für eine LED |
KR102261953B1 (ko) * | 2015-01-14 | 2021-06-08 | 엘지이노텍 주식회사 | 발광소자, 이를 포함하는 발광소자 패키지, 및 이를 포함하는 조명시스템 |
US10008739B2 (en) | 2015-02-23 | 2018-06-26 | Front Edge Technology, Inc. | Solid-state lithium battery with electrolyte |
KR102292640B1 (ko) | 2015-03-06 | 2021-08-23 | 삼성전자주식회사 | 발광 소자 패키지 및 발광 소자를 포함하는 전자 장치 |
KR102601579B1 (ko) | 2015-12-16 | 2023-11-13 | 삼성전자주식회사 | 발광소자 실장용 회로 기판 및 이를 이용한 반도체 발광소자 패키지 |
DE102016100352A1 (de) | 2016-01-11 | 2017-07-13 | Epcos Ag | Bauelementträger mit ESD Schutzfunktion und Verfahren zur Herstellung |
US10672957B2 (en) | 2017-07-19 | 2020-06-02 | Cree, Inc. | LED apparatuses and methods for high lumen output density |
WO2019051780A1 (zh) | 2017-09-15 | 2019-03-21 | 厦门市三安光电科技有限公司 | 一种白光led封装结构以及白光源系统 |
TWI705585B (zh) * | 2017-09-25 | 2020-09-21 | 致伸科技股份有限公司 | 光源模組 |
CN110137141A (zh) * | 2019-04-30 | 2019-08-16 | 华南理工大学 | 一种具有毛细微槽结构的去金属化陶瓷基板及其焊接方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05275269A (ja) * | 1992-03-30 | 1993-10-22 | Toshiba Corp | 積層セラミック電子部品 |
JPH05335174A (ja) * | 1992-05-28 | 1993-12-17 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JPH1012406A (ja) * | 1996-06-18 | 1998-01-16 | Marcon Electron Co Ltd | 積層セラミックバリスタ |
JPH114535A (ja) * | 1997-06-12 | 1999-01-06 | Murata Mfg Co Ltd | 保護用回路及び複合型保護用デバイス |
JPH11186053A (ja) * | 1997-12-18 | 1999-07-09 | Matsushita Electric Ind Co Ltd | 複合部品およびその製造方法 |
JPH11251644A (ja) * | 1998-02-27 | 1999-09-17 | Matsushita Electron Corp | 半導体発光装置 |
JP2001015815A (ja) * | 1999-04-28 | 2001-01-19 | Sanken Electric Co Ltd | 半導体発光装置 |
JP2003297634A (ja) * | 2003-02-17 | 2003-10-17 | Tdk Corp | 電子部品 |
JP2004014963A (ja) * | 2002-06-11 | 2004-01-15 | Matsushita Electric Ind Co Ltd | 静電対策部品 |
JP2004022976A (ja) * | 2002-06-19 | 2004-01-22 | Murata Mfg Co Ltd | 積層型電圧非直線抵抗体、及びその製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3679950A (en) * | 1971-04-16 | 1972-07-25 | Nl Industries Inc | Ceramic capacitors |
GB1346851A (en) * | 1971-05-21 | 1974-02-13 | Matsushita Electric Ind Co Ltd | Varistors |
US3743897A (en) | 1971-08-05 | 1973-07-03 | Gen Electric | Hybrid circuit arrangement with metal oxide varistor shunt |
US3965552A (en) * | 1972-07-24 | 1976-06-29 | N L Industries, Inc. | Process for forming internal conductors and electrodes |
DE3231118C1 (de) * | 1982-08-20 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Kombinierte Schaltungsanordnung mit Varistor und Verfahren zu ihrer Herstellung |
US5290375A (en) * | 1989-08-05 | 1994-03-01 | Nippondenso Co., Ltd. | Process for manufacturing ceramic multilayer substrate |
US5176772A (en) * | 1989-10-05 | 1993-01-05 | Asahi Glass Company Ltd. | Process for fabricating a multilayer ceramic circuit board |
GB9005990D0 (en) * | 1990-03-16 | 1990-05-09 | Ecco Ltd | Varistor powder compositions |
CA2113451A1 (en) * | 1991-09-12 | 1993-03-18 | Yi-Hung Chiao | Method of making co-fired, multilayer substrates |
JP3481778B2 (ja) * | 1996-06-28 | 2003-12-22 | 京セラ株式会社 | 窒化アルミニウム質焼結体およびその製造方法 |
KR100219080B1 (ko) | 1996-08-09 | 1999-09-01 | 김영환 | 반도체 장치의 패키지용 리드프레임 및 반도체 장치 |
JPH10308582A (ja) * | 1997-05-07 | 1998-11-17 | Denso Corp | 多層配線基板 |
JP3449599B2 (ja) * | 1999-03-26 | 2003-09-22 | Tdk株式会社 | 積層チップ型バリスタ |
US6535105B2 (en) * | 2000-03-30 | 2003-03-18 | Avx Corporation | Electronic device and process of making electronic device |
JP2001307947A (ja) * | 2000-04-25 | 2001-11-02 | Tdk Corp | 積層チップ部品及びその製造方法 |
TW492202B (en) * | 2001-06-05 | 2002-06-21 | South Epitaxy Corp | Structure of III-V light emitting diode (LED) arranged in flip chip configuration having structure for preventing electrostatic discharge |
US20030043012A1 (en) * | 2001-08-30 | 2003-03-06 | Kaori Shiraishi | Zinc oxide varistor and method of manufacturing same |
US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
-
2004
- 2004-02-25 US US10/787,657 patent/US7279724B2/en active Active
-
2005
- 2005-02-09 EP EP05100899.3A patent/EP1580809B1/en active Active
- 2005-02-18 JP JP2005042144A patent/JP5698424B2/ja active Active
- 2005-02-22 TW TW094105247A patent/TWI377692B/zh active
-
2007
- 2007-08-30 US US11/848,055 patent/US7768754B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05275269A (ja) * | 1992-03-30 | 1993-10-22 | Toshiba Corp | 積層セラミック電子部品 |
JPH05335174A (ja) * | 1992-05-28 | 1993-12-17 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JPH1012406A (ja) * | 1996-06-18 | 1998-01-16 | Marcon Electron Co Ltd | 積層セラミックバリスタ |
JPH114535A (ja) * | 1997-06-12 | 1999-01-06 | Murata Mfg Co Ltd | 保護用回路及び複合型保護用デバイス |
JPH11186053A (ja) * | 1997-12-18 | 1999-07-09 | Matsushita Electric Ind Co Ltd | 複合部品およびその製造方法 |
JPH11251644A (ja) * | 1998-02-27 | 1999-09-17 | Matsushita Electron Corp | 半導体発光装置 |
JP2001015815A (ja) * | 1999-04-28 | 2001-01-19 | Sanken Electric Co Ltd | 半導体発光装置 |
JP2004014963A (ja) * | 2002-06-11 | 2004-01-15 | Matsushita Electric Ind Co Ltd | 静電対策部品 |
JP2004022976A (ja) * | 2002-06-19 | 2004-01-22 | Murata Mfg Co Ltd | 積層型電圧非直線抵抗体、及びその製造方法 |
JP2003297634A (ja) * | 2003-02-17 | 2003-10-17 | Tdk Corp | 電子部品 |
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339559A (ja) * | 2005-06-06 | 2006-12-14 | Matsushita Electric Ind Co Ltd | Led部品およびその製造方法 |
KR100674857B1 (ko) | 2005-07-04 | 2007-01-29 | 삼성전기주식회사 | 정전기 방전(esd)을 강화한 엘이디 패키지 및 그제조방법 |
JP2007088173A (ja) * | 2005-09-21 | 2007-04-05 | Tdk Corp | 積層型チップバリスタ及び電子機器の製造方法 |
JP2007227882A (ja) * | 2006-02-23 | 2007-09-06 | Novalite Optronics Corp | 発光ダイオードパッケージとその製造方法 |
US7791449B2 (en) | 2006-03-27 | 2010-09-07 | Tdk Corporation | Varistor and light-emitting apparatus |
JP2007266097A (ja) * | 2006-03-27 | 2007-10-11 | Tdk Corp | バリスタ及び発光装置 |
JP4577250B2 (ja) * | 2006-03-27 | 2010-11-10 | Tdk株式会社 | バリスタ及び発光装置 |
JP2008028029A (ja) * | 2006-07-19 | 2008-02-07 | Tdk Corp | バリスタ及び発光装置 |
JP2008277716A (ja) * | 2007-03-30 | 2008-11-13 | Tdk Corp | バリスタ及び発光装置 |
WO2008129877A1 (ja) * | 2007-04-17 | 2008-10-30 | Panasonic Corporation | Led実装基板 |
JP2008283077A (ja) * | 2007-05-11 | 2008-11-20 | Tdk Corp | バリスタ及び発光装置 |
JP2009016616A (ja) * | 2007-07-05 | 2009-01-22 | Tdk Corp | サージ吸収素子及び発光装置 |
JP2011523776A (ja) * | 2008-05-21 | 2011-08-18 | エプコス アクチエンゲゼルシャフト | バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ |
JP2011524082A (ja) * | 2008-05-21 | 2011-08-25 | エプコス アクチエンゲゼルシャフト | バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ |
US9196402B2 (en) | 2008-05-21 | 2015-11-24 | Epcos Ag | Electronic component assembly comprising a varistor and a semiconductor component |
KR101529364B1 (ko) * | 2008-05-21 | 2015-06-16 | 에프코스 아게 | 배리스터 및 반도체 소자를 포함하는 전기 소자 장치 |
KR101529365B1 (ko) * | 2008-05-21 | 2015-06-16 | 에프코스 아게 | 배리스터 및 반도체 소자를 포함하는 전기 소자 어셈블리 |
KR101457207B1 (ko) | 2008-06-30 | 2014-11-03 | 서울바이오시스 주식회사 | 정전기 방전 보호소자가 구비된 발광 다이오드 |
JP2008263236A (ja) * | 2008-07-22 | 2008-10-30 | Tdk Corp | 電子機器 |
JP2008252150A (ja) * | 2008-07-22 | 2008-10-16 | Tdk Corp | 積層型チップバリスタ |
WO2011108227A1 (ja) * | 2010-03-01 | 2011-09-09 | パナソニック株式会社 | 発光素子用基板及びその製造方法ならびに発光装置 |
JP5834174B2 (ja) * | 2010-03-01 | 2015-12-16 | パナソニックIpマネジメント株式会社 | 発光素子用基板及びその製造方法ならびに発光装置 |
US9076714B2 (en) | 2010-03-01 | 2015-07-07 | Panasonic Intellectual Property Management Co., Ltd. | Substrate for mounting light-emitting element and light-emitting device |
JPWO2011108227A1 (ja) * | 2010-03-01 | 2013-06-20 | パナソニック株式会社 | 発光素子用基板及びその製造方法ならびに発光装置 |
WO2012063459A1 (ja) * | 2010-11-08 | 2012-05-18 | パナソニック株式会社 | 発光ダイオードモジュールおよびそれに用いられるセラミック基板 |
WO2013027413A1 (ja) * | 2011-08-25 | 2013-02-28 | パナソニック株式会社 | 保護素子及びこれを用いた発光装置 |
US9496471B2 (en) | 2012-05-25 | 2016-11-15 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
US9136439B2 (en) | 2012-05-25 | 2015-09-15 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
JP2016537820A (ja) * | 2013-11-21 | 2016-12-01 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス半導体チップ |
US10121775B2 (en) | 2013-11-21 | 2018-11-06 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip with built-in ESD protection |
JP2016213214A (ja) * | 2015-04-28 | 2016-12-15 | 日亜化学工業株式会社 | 発光素子 |
JP2019510377A (ja) * | 2016-03-24 | 2019-04-11 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | マルチledシステム |
US10818641B2 (en) | 2016-03-24 | 2020-10-27 | Epcos Ag | Multi-LED system |
JP2019514226A (ja) * | 2016-04-22 | 2019-05-30 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | 多層キャリアシステム、多層キャリアシステムの製造方法及び多層キャリアシステムの使用方法 |
CN110600918A (zh) * | 2018-06-13 | 2019-12-20 | 法雷奥照明公司 | 印刷电路板、卡缘连接器插座、电子组件和车辆照明装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200541108A (en) | 2005-12-16 |
TWI377692B (en) | 2012-11-21 |
US7768754B2 (en) | 2010-08-03 |
EP1580809B1 (en) | 2013-05-22 |
EP1580809A2 (en) | 2005-09-28 |
US20070297108A1 (en) | 2007-12-27 |
US20050184387A1 (en) | 2005-08-25 |
US7279724B2 (en) | 2007-10-09 |
EP1580809A3 (en) | 2008-07-09 |
JP5698424B2 (ja) | 2015-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5698424B2 (ja) | 基体にesd保護を組み入れた発光ダイオード用基体 | |
US10056357B2 (en) | Semiconductor light emitting device | |
CN101432896B (zh) | 用于半导体发光器件封装的子基板和包括其的半导体发光器件封装 | |
KR101360732B1 (ko) | 발광 다이오드 패키지 | |
US9705052B1 (en) | LED package structure | |
JP4915058B2 (ja) | Led部品およびその製造方法 | |
US9076714B2 (en) | Substrate for mounting light-emitting element and light-emitting device | |
CN101958389A (zh) | 一种硅基板集成有功能电路的led表面贴装结构及其封装方法 | |
WO2006106901A1 (ja) | Led部品およびその製造方法 | |
US20130062656A1 (en) | Thermally enhanced optical package | |
CN103890866B (zh) | Esd保护结构元件和带有esd保护结构元件与led的结构元件 | |
WO2008041813A1 (en) | Ceramic package and method of manufacturing the same | |
JP7393717B2 (ja) | 発光装置 | |
US7355251B2 (en) | Light emitting device | |
CN201904368U (zh) | 一种硅基板集成有功能电路的led表面贴装结构 | |
CN103618041A (zh) | 一种esd保护的led封装结构及其封装方法 | |
JP2008270327A (ja) | 静電気対策部品およびこれを用いた発光ダイオードモジュール | |
TWI405319B (zh) | 堆疊之積體電路晶片組成件 | |
EP1207563A2 (en) | Direct bonding of flip-chip light-emitting diode and flip-chip ESD protection chip to electrodes in a package | |
KR100674857B1 (ko) | 정전기 방전(esd)을 강화한 엘이디 패키지 및 그제조방법 | |
JP2008227137A (ja) | 静電気対策部品およびこれを用いた発光ダイオードモジュール | |
JPH07321160A (ja) | 半導体装置 | |
KR100644315B1 (ko) | 반도체 소자 패키지 | |
JPH0449641A (ja) | 半導体装置及び半導体装置用回路基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080212 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110131 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110428 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110509 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110729 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120402 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120702 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130212 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130612 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20130619 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20130711 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20130725 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20130920 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140606 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140918 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140924 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141222 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150213 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5698424 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |