JP2011524082A - バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ - Google Patents
バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ Download PDFInfo
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- JP2011524082A JP2011524082A JP2011509998A JP2011509998A JP2011524082A JP 2011524082 A JP2011524082 A JP 2011524082A JP 2011509998 A JP2011509998 A JP 2011509998A JP 2011509998 A JP2011509998 A JP 2011509998A JP 2011524082 A JP2011524082 A JP 2011524082A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Led Device Packages (AREA)
Abstract
【選択図】図1
Description
2 バリスタ体
3 キャリアまたはヒートシンク
4 キャリアの電気的端子
5 キャリアのめっきされたスルーホール
6 キャリアの熱伝導性チャネル
7 半導体構成要素の電気的端子
8 バリスタ体の内部電極
9a バリスタ体の外部電極
9b バリスタ体のめっきされたスルーホール
10 バリスタ体の熱伝導チャネル
11 さらなる電気的構成要素
12 ハウジング
13 ハウジングのくぼみ
14a ハウジングの第1の導電領域
14b ハウジングの第2の導電領域
14c ハウジングの第3の導電領域
15 絶縁層
Claims (15)
- 半導体構成要素(1)およびキャリア(3)を含み、前記キャリアが熱伝導性セラミックを含み、少なくとも1つのバリスタ体(2)に接続され、前記半導体構成要素からの熱が、前記バリスタ体によってキャリア(3)へ少なくとも部分的に消散されることが可能な、電気的構成要素アセンブリ。
- 前記キャリア(3)が、窒化アルミニウム、炭化ケイ素、酸化ハフニウム、酸化マンガンから選択された少なくとも1つの材料を含む、請求項1に記載の電気的構成要素アセンブリ。
- 前記キャリア(3)が、前記キャリアを取り囲む材料と異なる材料組成を有する少なくとも1つの熱伝導性チャネル(3)を含む、請求項1または2に記載の電気的構成要素アセンブリ。
- 前記バリスタ体(2)が前記キャリア(3)に取り付けられ、一方で、前記半導体構成要素(1)が、前記バリスタ体に取り付けられる、請求項1から3のいずれか一項に記載の電気的構成要素アセンブリ。
- 前記バリスタ体(2)が多層バリスタとして実施される、請求項4に記載の電気的構成要素アセンブリ。
- 前記バリスタ体(2)が少なくとも1つの熱伝導性チャネル(10)を含み、前記半導体構成要素(1)からの熱が該熱伝導性チャネル(10)を介して前記キャリア(2)に消散することができる、請求項4または5に記載の電気的構成要素アセンブリ。
- 前記バリスタ体(2)が前記キャリア(3)に一体化される、請求項1から3のいずれか一項に記載の電気的構成要素アセンブリ。
- 前記キャリア(3)が複数の電気的端子(4)を有し、少なくとも1つの第1の電気的端子が前記半導体構成要素(1)への電気的接続部を形成し、少なくとも1つの第2の電気的端子が外側に向けて電気的接続部を形成する、請求項1から7のいずれか一項に記載の電気的構成要素アセンブリ。
- 前記バリスタ体(2)が前記キャリア(3)に一体化され、前記キャリア(3)の前記第1および前記第2の電気的端子に接続される、請求項8に記載の電気的構成要素アセンブリ。
- 前記バリスタ体(2)がビアとして実施される、請求項9に記載の電気的構成要素アセンブリ。
- 前記バリスタ体(2)が、少なくとも基質としてのバリスタセラミックと充填材としての熱伝導性材料からなる複合材料を含む、請求項1から10のいずれか一項に記載の電気的構成要素アセンブリ。
- 前記バリスタ体(2)が少なくとも1つの内部電極(8)を有する、請求項1から11のいずれか一項に記載の電気的構成要素アセンブリ。
- 前記キャリア(3)がハウジング(12)に一体化され、前記ハウジングが、前記キャリアに接続されて前記キャリアに熱的に結合される熱伝導性領域を有する、請求項1から12のいずれか一項に記載の電気的構成要素アセンブリ。
- 前記半導体構成要素(1)が、以下の構成要素:光電子構成要素、LED、キャパシタ、多層キャパシタ、サーミスタ、多層サーミスタ、ダイオード、増幅器、から選択される、請求項1から13のいずれか一項に記載の電気的構成要素アセンブリ。
- 抵抗/温度特性曲線に従属するような、前記半導体構成要素(1)の制御電流の調整に寄与する、サーミスタをさらに有する、請求項1から14のいずれか一項に記載の電気的構成要素アセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008024480A DE102008024480A1 (de) | 2008-05-21 | 2008-05-21 | Elektrische Bauelementanordnung |
DE102008024480.5 | 2008-05-21 | ||
PCT/EP2009/056251 WO2009141439A1 (de) | 2008-05-21 | 2009-05-22 | Elektrische bauelementanordnung mit varistor und halbleiterbauelement |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011524082A true JP2011524082A (ja) | 2011-08-25 |
JP2011524082A5 JP2011524082A5 (ja) | 2012-04-05 |
JP5607028B2 JP5607028B2 (ja) | 2014-10-15 |
Family
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011509998A Active JP5607028B2 (ja) | 2008-05-21 | 2009-05-22 | バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ |
Country Status (7)
Country | Link |
---|---|
US (1) | US9196402B2 (ja) |
EP (1) | EP2289075B1 (ja) |
JP (1) | JP5607028B2 (ja) |
KR (1) | KR101529365B1 (ja) |
DE (1) | DE102008024480A1 (ja) |
TW (1) | TWI512915B (ja) |
WO (1) | WO2009141439A1 (ja) |
Cited By (5)
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JP2015526908A (ja) * | 2012-08-31 | 2015-09-10 | エプコス アクチエンゲゼルシャフトEpcos Ag | 発光ダイオード装置 |
JP2016213214A (ja) * | 2015-04-28 | 2016-12-15 | 日亜化学工業株式会社 | 発光素子 |
JP2019506741A (ja) * | 2016-01-11 | 2019-03-07 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | Esd保護機能を有するデバイス担体とその製造のための方法 |
JP2019083328A (ja) * | 2014-08-08 | 2019-05-30 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | Led用担体 |
JP2019536282A (ja) * | 2016-11-16 | 2019-12-12 | テーデーカー エレクトロニクス アーゲー | 欠陥感受性が低減されたパワーモジュール及びその使用 |
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US9320135B2 (en) * | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
JP5596410B2 (ja) * | 2010-05-18 | 2014-09-24 | スタンレー電気株式会社 | 半導体発光装置 |
JP2014026993A (ja) * | 2010-11-08 | 2014-02-06 | Panasonic Corp | セラミック基板と発光ダイオードモジュール |
TW201221501A (en) * | 2010-11-26 | 2012-06-01 | Sfi Electronics Technology Inc | Process for producing ZnO varistor particularly having internal electrode composed of pure silver and sintered at a lower sintering temperature |
CN103339483B (zh) * | 2010-12-02 | 2015-10-07 | 雀巢产品技术援助有限公司 | 饮料机中的低惯性热传感器 |
US20150098966A1 (en) | 2012-05-16 | 2015-04-09 | Kj Biosciences Llc | Influenza vaccines |
DE102012104494A1 (de) * | 2012-05-24 | 2013-11-28 | Epcos Ag | Leuchtdiodenvorrichtung |
TWI479164B (zh) * | 2012-06-05 | 2015-04-01 | Advantest Corp | Test vehicle |
DE102012111458B4 (de) * | 2012-11-27 | 2022-12-08 | Tdk Electronics Ag | Halbleitervorrichtung |
DE102012113014A1 (de) * | 2012-12-21 | 2014-06-26 | Epcos Ag | Bauelementträger und Bauelementträgeranordnung |
DE102013101262A1 (de) * | 2013-02-08 | 2014-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer |
DE112014006583B4 (de) * | 2014-05-23 | 2021-05-27 | Mitsubishi Electric Corporation | Überspannungsschutzelement |
FR3026600A1 (fr) * | 2014-09-29 | 2016-04-01 | Valeo Vision | Carte de circuit imprime a led |
JP6668617B2 (ja) * | 2015-06-04 | 2020-03-18 | 富士電機株式会社 | サーミスタ搭載装置およびサーミスタ部品 |
US9979187B2 (en) * | 2015-11-12 | 2018-05-22 | Infineon Technologies Austria Ag | Power device with overvoltage arrester |
DE102016107495B4 (de) * | 2016-04-22 | 2022-04-14 | Tdk Electronics Ag | Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems |
DE102016107493B4 (de) * | 2016-04-22 | 2021-10-14 | Tdk Electronics Ag | Trägersystem, Verfahren zu seiner Herstellung und Verwendung desselben |
DE102016109853B4 (de) | 2016-05-30 | 2021-08-12 | Infineon Technologies Ag | Chipträger und Halbleitervorrichtung mit Umverteilungsstrukturen sowie Verfahren zur Herstellung einer Umverteilungsstruktur |
CZ307422B6 (cs) * | 2017-03-15 | 2018-08-08 | Saltek S.R.O. | Omezovač napětí s přepěťovou ochranou |
KR102123813B1 (ko) * | 2017-08-23 | 2020-06-18 | 스템코 주식회사 | 연성 회로 기판 및 그 제조 방법 |
AT521919B1 (de) * | 2018-12-13 | 2022-07-15 | Johann Kuebel Ing | Vorrichtung zur Abgabe von Licht |
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- 2008-05-21 DE DE102008024480A patent/DE102008024480A1/de not_active Ceased
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2009
- 2009-05-20 TW TW098116656A patent/TWI512915B/zh active
- 2009-05-22 US US12/994,143 patent/US9196402B2/en active Active
- 2009-05-22 JP JP2011509998A patent/JP5607028B2/ja active Active
- 2009-05-22 EP EP09749929.7A patent/EP2289075B1/de active Active
- 2009-05-22 WO PCT/EP2009/056251 patent/WO2009141439A1/de active Application Filing
- 2009-05-22 KR KR1020107028771A patent/KR101529365B1/ko active IP Right Grant
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015526908A (ja) * | 2012-08-31 | 2015-09-10 | エプコス アクチエンゲゼルシャフトEpcos Ag | 発光ダイオード装置 |
US9337408B2 (en) | 2012-08-31 | 2016-05-10 | Epcos Ag | Light-emitting diode device |
JP2019083328A (ja) * | 2014-08-08 | 2019-05-30 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | Led用担体 |
JP2016213214A (ja) * | 2015-04-28 | 2016-12-15 | 日亜化学工業株式会社 | 発光素子 |
JP2019506741A (ja) * | 2016-01-11 | 2019-03-07 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | Esd保護機能を有するデバイス担体とその製造のための方法 |
JP2019536282A (ja) * | 2016-11-16 | 2019-12-12 | テーデーカー エレクトロニクス アーゲー | 欠陥感受性が低減されたパワーモジュール及びその使用 |
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DE102008024480A1 (de) | 2009-12-03 |
WO2009141439A1 (de) | 2009-11-26 |
KR20110016448A (ko) | 2011-02-17 |
JP5607028B2 (ja) | 2014-10-15 |
KR101529365B1 (ko) | 2015-06-16 |
US20110261536A1 (en) | 2011-10-27 |
TW200950027A (en) | 2009-12-01 |
TWI512915B (zh) | 2015-12-11 |
EP2289075B1 (de) | 2017-09-06 |
EP2289075A1 (de) | 2011-03-02 |
US9196402B2 (en) | 2015-11-24 |
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