JP2013046072A - 発光素子パッケージ、光源モジュール及びこれを含む照明システム - Google Patents

発光素子パッケージ、光源モジュール及びこれを含む照明システム Download PDF

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Publication number
JP2013046072A
JP2013046072A JP2012183660A JP2012183660A JP2013046072A JP 2013046072 A JP2013046072 A JP 2013046072A JP 2012183660 A JP2012183660 A JP 2012183660A JP 2012183660 A JP2012183660 A JP 2012183660A JP 2013046072 A JP2013046072 A JP 2013046072A
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Japan
Prior art keywords
light emitting
emitting device
layer
device package
electrode
Prior art date
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Pending
Application number
JP2012183660A
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English (en)
Japanese (ja)
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JP2013046072A5 (enExample
Inventor
Su-Jong Jeong
ジョン・スジョン
Yon Tae Moon
ムーン・ヨンテ
Young Jun Cho
チョ・ヨンジュン
Son Kyo Hwang
ファン・ソンキョ
Byeong-Mok Kim
キム・ビヨンモク
Seo Yeon Kwon
クォン・ソヨン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110083721A external-priority patent/KR20130021298A/ko
Priority claimed from KR1020110084718A external-priority patent/KR20130022053A/ko
Priority claimed from KR1020110131466A external-priority patent/KR101902393B1/ko
Priority claimed from KR1020110140236A external-priority patent/KR101891717B1/ko
Priority claimed from KR1020110139806A external-priority patent/KR101976531B1/ko
Priority claimed from KR1020110143152A external-priority patent/KR20130074991A/ko
Priority claimed from KR1020110147361A external-priority patent/KR101894353B1/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2013046072A publication Critical patent/JP2013046072A/ja
Publication of JP2013046072A5 publication Critical patent/JP2013046072A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2012183660A 2011-08-22 2012-08-22 発光素子パッケージ、光源モジュール及びこれを含む照明システム Pending JP2013046072A (ja)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
KR1020110083721A KR20130021298A (ko) 2011-08-22 2011-08-22 발광소자 패키지, 라이트 유닛 및 표시장치
KR10-2011-0083721 2011-08-22
KR10-2011-0084718 2011-08-24
KR1020110084718A KR20130022053A (ko) 2011-08-24 2011-08-24 발광소자 패키지, 발광소자 패키지 제조방법, 라이트 유닛, 표시장치
KR10-2011-0131466 2011-12-09
KR1020110131466A KR101902393B1 (ko) 2011-12-09 2011-12-09 발광소자 패키지
KR10-2011-0139806 2011-12-22
KR1020110140236A KR101891717B1 (ko) 2011-12-22 2011-12-22 발광소자 패키지 및 이를 포함하는 조명시스템
KR1020110139806A KR101976531B1 (ko) 2011-12-22 2011-12-22 발광 모듈
KR10-2011-0140236 2011-12-22
KR10-2011-0143152 2011-12-27
KR1020110143152A KR20130074991A (ko) 2011-12-27 2011-12-27 발광 모듈
KR10-2011-0147361 2011-12-30
KR1020110147361A KR101894353B1 (ko) 2011-12-30 2011-12-30 발광소자 패키지 및 이를 포함하는 조명시스템

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017085863A Division JP6312899B2 (ja) 2011-08-22 2017-04-25 発光素子パッケージ、光源モジュール及びこれを含む照明システム

Publications (2)

Publication Number Publication Date
JP2013046072A true JP2013046072A (ja) 2013-03-04
JP2013046072A5 JP2013046072A5 (enExample) 2015-10-01

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012183660A Pending JP2013046072A (ja) 2011-08-22 2012-08-22 発光素子パッケージ、光源モジュール及びこれを含む照明システム
JP2017085863A Expired - Fee Related JP6312899B2 (ja) 2011-08-22 2017-04-25 発光素子パッケージ、光源モジュール及びこれを含む照明システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017085863A Expired - Fee Related JP6312899B2 (ja) 2011-08-22 2017-04-25 発光素子パッケージ、光源モジュール及びこれを含む照明システム

Country Status (4)

Country Link
US (1) US8773006B2 (enExample)
EP (1) EP2562832B1 (enExample)
JP (2) JP2013046072A (enExample)
CN (1) CN103078033B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
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JP2015057826A (ja) * 2013-09-16 2015-03-26 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP2017502515A (ja) * 2013-12-20 2017-01-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス半導体部品と、自動車用のアダプティブヘッドライト
KR101738980B1 (ko) 2015-02-05 2017-05-24 주식회사 루멘스 발광 모듈 및 조명 장치
JP2019514226A (ja) * 2016-04-22 2019-05-30 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ 多層キャリアシステム、多層キャリアシステムの製造方法及び多層キャリアシステムの使用方法
JP2021192422A (ja) * 2020-04-02 2021-12-16 日亜化学工業株式会社 面状光源及びその製造方法
JP2022526566A (ja) * 2019-03-29 2022-05-25 ルミレッズ リミテッド ライアビリティ カンパニー 埋込バックプレーンを有するファンアウト発光ダイオード（ｌｅｄ）デバイス基板、照明システム及び製造方法

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KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지
KR101373710B1 (ko) * 2012-12-12 2014-03-13 (주)포인트엔지니어링 엘이디 금속기판 패키지 및 그 제조방법
KR102053408B1 (ko) 2013-07-11 2019-12-06 엘지이노텍 주식회사 발광 소자
KR20150039518A (ko) * 2013-10-02 2015-04-10 엘지이노텍 주식회사 발광소자
JP6171921B2 (ja) * 2013-12-24 2017-08-02 日亜化学工業株式会社 配線基板及び発光装置
KR20160036862A (ko) 2014-09-26 2016-04-05 서울바이오시스 주식회사 발광 소자 제조 방법 및 그것에 의해 제조된 발광 소자
CN106338043B (zh) * 2015-07-06 2020-11-03 松下知识产权经营株式会社 光源单元、照明装置和车辆
KR102588807B1 (ko) 2016-12-15 2023-10-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 그 제조방법, 자동 초점 장치
EP3605620B1 (en) * 2017-03-21 2024-05-29 LG Innotek Co., Ltd. Semiconductor element package
JP6748302B2 (ja) * 2017-05-26 2020-08-26 京セラ株式会社 電子部品搭載用基板、電子装置および電子モジュール
CN110832648A (zh) 2017-06-27 2020-02-21 日本碍子株式会社 透明密封构件及其制造方法
EP3528296B1 (en) * 2018-02-16 2020-06-03 Nichia Corporation Light emitting element and light emitting device
CN109031779B (zh) * 2018-07-25 2024-06-11 京东方科技集团股份有限公司 发光二极管基板、背光模组和显示装置
KR20200064399A (ko) * 2018-11-29 2020-06-08 주식회사 글로우원 투명 led 패널
CN111384220A (zh) * 2018-12-27 2020-07-07 南昌欧菲生物识别技术有限公司 光发射器、深度相机及电子设备
CN110752281A (zh) * 2019-10-31 2020-02-04 开发晶照明（厦门）有限公司 发光二极管封装结构及其承载座
US11156346B2 (en) 2019-11-19 2021-10-26 Lumileds Llc Fan out structure for light-emitting diode (LED) device and lighting system
CN111029896B (zh) * 2019-12-23 2021-02-05 常州纵慧芯光半导体科技有限公司 一种eel激光器tof模组封装结构及其制作方法
US11777066B2 (en) 2019-12-27 2023-10-03 Lumileds Llc Flipchip interconnected light-emitting diode package assembly
US11664347B2 (en) 2020-01-07 2023-05-30 Lumileds Llc Ceramic carrier and build up carrier for light-emitting diode (LED) array
TWI777125B (zh) * 2020-01-22 2022-09-11 晶智達光電股份有限公司 雷射元件封裝結構
US11476217B2 (en) 2020-03-10 2022-10-18 Lumileds Llc Method of manufacturing an augmented LED array assembly
WO2021246776A1 (ko) * 2020-06-03 2021-12-09 서울바이오시스주식회사 발광 소자 모듈 및 이를 포함하는 디스플레이 장치
TWI887269B (zh) * 2020-09-17 2025-06-21 晶智達光電股份有限公司 雷射封裝結構
KR102885548B1 (ko) * 2020-12-15 2025-11-12 엘지디스플레이 주식회사 광원유닛 및 이를 포함하는 표시장치
KR20230020619A (ko) * 2021-08-03 2023-02-13 삼성전자주식회사 반도체 자외선 발광소자 패키지

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JP2017502515A (ja) * 2013-12-20 2017-01-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス半導体部品と、自動車用のアダプティブヘッドライト
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EP2562832B1 (en) 2019-12-18
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