JP2009130054A5 - - Google Patents

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Publication number
JP2009130054A5
JP2009130054A5 JP2007302007A JP2007302007A JP2009130054A5 JP 2009130054 A5 JP2009130054 A5 JP 2009130054A5 JP 2007302007 A JP2007302007 A JP 2007302007A JP 2007302007 A JP2007302007 A JP 2007302007A JP 2009130054 A5 JP2009130054 A5 JP 2009130054A5
Authority
JP
Japan
Prior art keywords
wiring
support
concave
layer
convex portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007302007A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009130054A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007302007A priority Critical patent/JP2009130054A/ja
Priority claimed from JP2007302007A external-priority patent/JP2009130054A/ja
Priority to US12/274,719 priority patent/US20090134530A1/en
Priority to KR1020080115571A priority patent/KR20090052814A/ko
Priority to TW097145075A priority patent/TW200924596A/zh
Priority to EP08169709A priority patent/EP2066156A3/en
Publication of JP2009130054A publication Critical patent/JP2009130054A/ja
Publication of JP2009130054A5 publication Critical patent/JP2009130054A5/ja
Pending legal-status Critical Current

Links

JP2007302007A 2007-11-21 2007-11-21 配線基板及びその製造方法 Pending JP2009130054A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007302007A JP2009130054A (ja) 2007-11-21 2007-11-21 配線基板及びその製造方法
US12/274,719 US20090134530A1 (en) 2007-11-21 2008-11-20 Wiring substrate and method of manufacturing the same
KR1020080115571A KR20090052814A (ko) 2007-11-21 2008-11-20 배선기판 및 이의 제조방법
TW097145075A TW200924596A (en) 2007-11-21 2008-11-21 Wiring substrate and method of manufacturing the same
EP08169709A EP2066156A3 (en) 2007-11-21 2008-11-21 Wiring substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007302007A JP2009130054A (ja) 2007-11-21 2007-11-21 配線基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2009130054A JP2009130054A (ja) 2009-06-11
JP2009130054A5 true JP2009130054A5 (enExample) 2010-10-21

Family

ID=40409951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007302007A Pending JP2009130054A (ja) 2007-11-21 2007-11-21 配線基板及びその製造方法

Country Status (5)

Country Link
US (1) US20090134530A1 (enExample)
EP (1) EP2066156A3 (enExample)
JP (1) JP2009130054A (enExample)
KR (1) KR20090052814A (enExample)
TW (1) TW200924596A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120342B2 (ja) * 2009-06-18 2013-01-16 ソニー株式会社 半導体パッケージの製造方法
US8127979B1 (en) * 2010-09-25 2012-03-06 Intel Corporation Electrolytic depositon and via filling in coreless substrate processing
KR102079256B1 (ko) * 2013-09-13 2020-02-20 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
JP2017017238A (ja) * 2015-07-03 2017-01-19 株式会社ジェイデバイス 半導体装置及びその製造方法
US20180190596A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Standoff members for semiconductor package
KR101938104B1 (ko) * 2018-01-25 2019-01-14 주식회사 기가레인 접합 평탄도가 개선된 연성회로기판
CN112038242A (zh) * 2020-09-10 2020-12-04 华进半导体封装先导技术研发中心有限公司 先重布线扇出型封装方法及结构
KR102901072B1 (ko) * 2023-08-07 2025-12-16 삼성전기주식회사 회로 기판

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050877A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージ
JP4400802B2 (ja) * 1999-08-23 2010-01-20 大日本印刷株式会社 リードフレーム及びその製造方法並びに半導体装置
JP2002299495A (ja) * 2001-03-30 2002-10-11 Fuji Electric Co Ltd 半導体回路基板
US6552267B2 (en) * 2001-08-13 2003-04-22 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectronic assembly with stiffening member
SG102637A1 (en) * 2001-09-10 2004-03-26 Micron Technology Inc Bow control in an electronic package
JP3615727B2 (ja) * 2001-10-31 2005-02-02 新光電気工業株式会社 半導体装置用パッケージ
JP3664720B2 (ja) 2001-10-31 2005-06-29 新光電気工業株式会社 半導体装置用多層回路基板の製造方法
JP4094494B2 (ja) * 2002-08-23 2008-06-04 新光電気工業株式会社 半導体パッケージ
AU2003227213A1 (en) * 2003-03-26 2004-10-18 Fujitsu Limited Semiconductor device
JP4460341B2 (ja) * 2004-04-09 2010-05-12 日本特殊陶業株式会社 配線基板およびその製造方法
JP2006186136A (ja) * 2004-12-28 2006-07-13 Toshiba Corp 両面部品実装回路基板及びその製造方法

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