JP2013008880A5 - - Google Patents

Download PDF

Info

Publication number
JP2013008880A5
JP2013008880A5 JP2011141232A JP2011141232A JP2013008880A5 JP 2013008880 A5 JP2013008880 A5 JP 2013008880A5 JP 2011141232 A JP2011141232 A JP 2011141232A JP 2011141232 A JP2011141232 A JP 2011141232A JP 2013008880 A5 JP2013008880 A5 JP 2013008880A5
Authority
JP
Japan
Prior art keywords
circuit board
hole
prepreg
manufacturing
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011141232A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013008880A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011141232A priority Critical patent/JP2013008880A/ja
Priority claimed from JP2011141232A external-priority patent/JP2013008880A/ja
Priority to US13/453,211 priority patent/US20120325533A1/en
Priority to TW101114514A priority patent/TW201301967A/zh
Priority to CN201210143582XA priority patent/CN102843876A/zh
Priority to KR1020120049609A priority patent/KR20130007415A/ko
Publication of JP2013008880A publication Critical patent/JP2013008880A/ja
Publication of JP2013008880A5 publication Critical patent/JP2013008880A5/ja
Withdrawn legal-status Critical Current

Links

JP2011141232A 2011-06-24 2011-06-24 積層回路基板の製造方法及び積層回路基板 Withdrawn JP2013008880A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011141232A JP2013008880A (ja) 2011-06-24 2011-06-24 積層回路基板の製造方法及び積層回路基板
US13/453,211 US20120325533A1 (en) 2011-06-24 2012-04-23 Method of manufacturing multilayer circuit board and multilayer circuit board
TW101114514A TW201301967A (zh) 2011-06-24 2012-04-24 製造多層電路板的方法及多層電路板
CN201210143582XA CN102843876A (zh) 2011-06-24 2012-05-09 制造多层电路板的方法和多层电路板
KR1020120049609A KR20130007415A (ko) 2011-06-24 2012-05-10 적층 회로 기판의 제조 방법 및 적층 회로 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011141232A JP2013008880A (ja) 2011-06-24 2011-06-24 積層回路基板の製造方法及び積層回路基板

Publications (2)

Publication Number Publication Date
JP2013008880A JP2013008880A (ja) 2013-01-10
JP2013008880A5 true JP2013008880A5 (enExample) 2014-04-10

Family

ID=47360763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011141232A Withdrawn JP2013008880A (ja) 2011-06-24 2011-06-24 積層回路基板の製造方法及び積層回路基板

Country Status (5)

Country Link
US (1) US20120325533A1 (enExample)
JP (1) JP2013008880A (enExample)
KR (1) KR20130007415A (enExample)
CN (1) CN102843876A (enExample)
TW (1) TW201301967A (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6088724B2 (ja) * 2010-08-31 2017-03-01 ユニ・チャーム株式会社 吸収体の製造装置、及び通気性部材の製造方法
US9288917B2 (en) * 2013-11-07 2016-03-15 Unimicron Technology Corp. Manufacturing method for multi-layer circuit board
JP6383252B2 (ja) * 2014-10-30 2018-08-29 ルネサスエレクトロニクス株式会社 電子装置およびその製造方法
CN104538314B (zh) * 2014-12-29 2017-08-11 华进半导体封装先导技术研发中心有限公司 三层封装基板及封装芯片的制作方法及三层封装基板
CN104768326B (zh) * 2015-03-31 2017-11-24 华为技术有限公司 印刷电路板及印刷电路板制造方法
TWI608779B (zh) * 2016-04-20 2017-12-11 中華精測科技股份有限公司 高密度互連多層電路板及其製造方法
US10002839B2 (en) * 2016-08-29 2018-06-19 Via Alliance Semiconductor Co., Ltd. Electronic structure, and electronic structure array
KR101858186B1 (ko) * 2016-12-26 2018-05-15 주식회사 카펙발레오 차량용 토크 컨버터
CN107257603B (zh) 2017-06-20 2019-11-08 广州兴森快捷电路科技有限公司 孔连接层的制作方法、线路板的制作方法及线路板
CN107155266B (zh) * 2017-06-20 2020-10-23 广州兴森快捷电路科技有限公司 Z向互连线路板及其制作方法
CN107864555B (zh) * 2017-12-09 2024-02-09 中国电子科技集团公司第四十三研究所 一种柔性电路板
CN110165442B (zh) * 2018-02-12 2020-11-03 泰达电子股份有限公司 金属块焊接柱组合及其应用的电源模块
CN111385981B (zh) * 2018-12-29 2025-01-03 深南电路股份有限公司 多样化装配印刷线路板及制造方法
TWI706705B (zh) * 2019-06-21 2020-10-01 唐虞企業股份有限公司 電路板及其製造方法
EP4040926A1 (en) 2021-02-09 2022-08-10 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carriers connected by staggered interconnect elements
US11950378B2 (en) * 2021-08-13 2024-04-02 Harbor Electronics, Inc. Via bond attachment
KR20230046708A (ko) * 2021-09-30 2023-04-06 삼성전자주식회사 열경화성 본딩 시트를 포함하는 전자 장치
KR20240101630A (ko) * 2022-12-12 2024-07-02 하버 일렉트로닉스 인크. 비아 결합 부착
KR102729754B1 (ko) * 2022-12-28 2024-11-13 주식회사 이에스이 솔더 페이스트 균일밀도공급이 가능한 밀폐형 스퀴지

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4043115B2 (ja) * 1998-09-24 2008-02-06 イビデン株式会社 多数個取り多層プリント配線板
CN1199536C (zh) * 1999-10-26 2005-04-27 伊比登株式会社 多层印刷配线板及多层印刷配线板的制造方法
JP4742485B2 (ja) * 2003-03-24 2011-08-10 富士通株式会社 多層プリント配線板及びその製造方法
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
TW200616523A (en) * 2004-10-08 2006-05-16 Matsushita Electric Industrial Co Ltd Multilayer circuit board manufacturing method
JP4797742B2 (ja) * 2006-03-28 2011-10-19 パナソニック株式会社 多層配線基板とその製造方法

Similar Documents

Publication Publication Date Title
JP2013008880A5 (enExample)
JP2013247353A5 (enExample)
JP2014003087A5 (enExample)
JP2016046418A5 (enExample)
JP2014022465A5 (enExample)
JP2009094195A5 (enExample)
JP2009283739A5 (enExample)
JP2015070007A5 (enExample)
JP2014056925A5 (enExample)
JP2014110390A5 (enExample)
PH12012501156A1 (en) Conductive connecting material, method for producing electronic component, electronic member with conductive connecting material and electronic component
JP2014239186A5 (enExample)
JP2010141176A5 (enExample)
JP2011014888A5 (enExample)
WO2008155957A1 (ja) 部品内蔵基板の製造方法および部品内蔵基板
JP2013062314A5 (enExample)
WO2013054249A3 (en) A method of assembling vcsel chips on a sub-mount
JP2013186310A5 (enExample)
JP2013219191A5 (enExample)
JP2014003054A5 (enExample)
JP2014239187A5 (enExample)
JP2012094662A5 (ja) 多層配線基板及びその製造方法
JP2013033894A5 (enExample)
JP2013084852A5 (enExample)
WO2011068359A3 (ko) Rfid 태그 내장형 인레이와, 이를 포함하는 카드, 및 rfid 태그 내장형 인레이의 제조 방법