TW201301967A - 製造多層電路板的方法及多層電路板 - Google Patents
製造多層電路板的方法及多層電路板 Download PDFInfo
- Publication number
- TW201301967A TW201301967A TW101114514A TW101114514A TW201301967A TW 201301967 A TW201301967 A TW 201301967A TW 101114514 A TW101114514 A TW 101114514A TW 101114514 A TW101114514 A TW 101114514A TW 201301967 A TW201301967 A TW 201301967A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- hole
- prepreg
- land
- region
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 229920005989 resin Polymers 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 25
- 239000004744 fabric Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- 239000000835 fiber Substances 0.000 claims 6
- 238000007747 plating Methods 0.000 claims 5
- 238000007598 dipping method Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 4
- 239000007787 solid Substances 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 27
- 239000000853 adhesive Substances 0.000 description 26
- 230000001070 adhesive effect Effects 0.000 description 26
- 239000010410 layer Substances 0.000 description 26
- 239000007788 liquid Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 13
- 239000011152 fibreglass Substances 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- -1 Polyethylene Terephthalate Polymers 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011141232A JP2013008880A (ja) | 2011-06-24 | 2011-06-24 | 積層回路基板の製造方法及び積層回路基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201301967A true TW201301967A (zh) | 2013-01-01 |
Family
ID=47360763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101114514A TW201301967A (zh) | 2011-06-24 | 2012-04-24 | 製造多層電路板的方法及多層電路板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20120325533A1 (enExample) |
| JP (1) | JP2013008880A (enExample) |
| KR (1) | KR20130007415A (enExample) |
| CN (1) | CN102843876A (enExample) |
| TW (1) | TW201301967A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI608779B (zh) * | 2016-04-20 | 2017-12-11 | 中華精測科技股份有限公司 | 高密度互連多層電路板及其製造方法 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6088724B2 (ja) * | 2010-08-31 | 2017-03-01 | ユニ・チャーム株式会社 | 吸収体の製造装置、及び通気性部材の製造方法 |
| US9288917B2 (en) * | 2013-11-07 | 2016-03-15 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
| JP6383252B2 (ja) * | 2014-10-30 | 2018-08-29 | ルネサスエレクトロニクス株式会社 | 電子装置およびその製造方法 |
| CN104538314B (zh) * | 2014-12-29 | 2017-08-11 | 华进半导体封装先导技术研发中心有限公司 | 三层封装基板及封装芯片的制作方法及三层封装基板 |
| CN104768326B (zh) * | 2015-03-31 | 2017-11-24 | 华为技术有限公司 | 印刷电路板及印刷电路板制造方法 |
| US10002839B2 (en) * | 2016-08-29 | 2018-06-19 | Via Alliance Semiconductor Co., Ltd. | Electronic structure, and electronic structure array |
| KR101858186B1 (ko) * | 2016-12-26 | 2018-05-15 | 주식회사 카펙발레오 | 차량용 토크 컨버터 |
| CN107155266B (zh) * | 2017-06-20 | 2020-10-23 | 广州兴森快捷电路科技有限公司 | Z向互连线路板及其制作方法 |
| CN107257603B (zh) * | 2017-06-20 | 2019-11-08 | 广州兴森快捷电路科技有限公司 | 孔连接层的制作方法、线路板的制作方法及线路板 |
| CN107864555B (zh) * | 2017-12-09 | 2024-02-09 | 中国电子科技集团公司第四十三研究所 | 一种柔性电路板 |
| CN110165442B (zh) * | 2018-02-12 | 2020-11-03 | 泰达电子股份有限公司 | 金属块焊接柱组合及其应用的电源模块 |
| CN111385981B (zh) * | 2018-12-29 | 2025-01-03 | 深南电路股份有限公司 | 多样化装配印刷线路板及制造方法 |
| TWI706705B (zh) * | 2019-06-21 | 2020-10-01 | 唐虞企業股份有限公司 | 電路板及其製造方法 |
| EP4040926A1 (en) | 2021-02-09 | 2022-08-10 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carriers connected by staggered interconnect elements |
| US11950378B2 (en) * | 2021-08-13 | 2024-04-02 | Harbor Electronics, Inc. | Via bond attachment |
| KR20230046708A (ko) * | 2021-09-30 | 2023-04-06 | 삼성전자주식회사 | 열경화성 본딩 시트를 포함하는 전자 장치 |
| CN118489191A (zh) * | 2022-12-12 | 2024-08-13 | 港湾电子股份有限公司 | 通孔接合连接 |
| KR102729754B1 (ko) * | 2022-12-28 | 2024-11-13 | 주식회사 이에스이 | 솔더 페이스트 균일밀도공급이 가능한 밀폐형 스퀴지 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4043115B2 (ja) * | 1998-09-24 | 2008-02-06 | イビデン株式会社 | 多数個取り多層プリント配線板 |
| CN1199536C (zh) * | 1999-10-26 | 2005-04-27 | 伊比登株式会社 | 多层印刷配线板及多层印刷配线板的制造方法 |
| JP4742485B2 (ja) * | 2003-03-24 | 2011-08-10 | 富士通株式会社 | 多層プリント配線板及びその製造方法 |
| JP4536430B2 (ja) * | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
| WO2006040942A1 (ja) * | 2004-10-08 | 2006-04-20 | Matsushita Electric Industrial Co., Ltd. | 多層回路基板の製造方法 |
| JP4797742B2 (ja) * | 2006-03-28 | 2011-10-19 | パナソニック株式会社 | 多層配線基板とその製造方法 |
-
2011
- 2011-06-24 JP JP2011141232A patent/JP2013008880A/ja not_active Withdrawn
-
2012
- 2012-04-23 US US13/453,211 patent/US20120325533A1/en not_active Abandoned
- 2012-04-24 TW TW101114514A patent/TW201301967A/zh unknown
- 2012-05-09 CN CN201210143582XA patent/CN102843876A/zh active Pending
- 2012-05-10 KR KR1020120049609A patent/KR20130007415A/ko not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI608779B (zh) * | 2016-04-20 | 2017-12-11 | 中華精測科技股份有限公司 | 高密度互連多層電路板及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130007415A (ko) | 2013-01-18 |
| US20120325533A1 (en) | 2012-12-27 |
| JP2013008880A (ja) | 2013-01-10 |
| CN102843876A (zh) | 2012-12-26 |
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