JP2014003087A5 - - Google Patents

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Publication number
JP2014003087A5
JP2014003087A5 JP2012136118A JP2012136118A JP2014003087A5 JP 2014003087 A5 JP2014003087 A5 JP 2014003087A5 JP 2012136118 A JP2012136118 A JP 2012136118A JP 2012136118 A JP2012136118 A JP 2012136118A JP 2014003087 A5 JP2014003087 A5 JP 2014003087A5
Authority
JP
Japan
Prior art keywords
hole
core layer
electronic component
wiring
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012136118A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014003087A (ja
JP6029342B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012136118A priority Critical patent/JP6029342B2/ja
Priority claimed from JP2012136118A external-priority patent/JP6029342B2/ja
Priority to US13/914,894 priority patent/US9161453B2/en
Priority to KR1020130067810A priority patent/KR101975302B1/ko
Publication of JP2014003087A publication Critical patent/JP2014003087A/ja
Publication of JP2014003087A5 publication Critical patent/JP2014003087A5/ja
Application granted granted Critical
Publication of JP6029342B2 publication Critical patent/JP6029342B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012136118A 2012-06-15 2012-06-15 配線基板及びその製造方法 Active JP6029342B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012136118A JP6029342B2 (ja) 2012-06-15 2012-06-15 配線基板及びその製造方法
US13/914,894 US9161453B2 (en) 2012-06-15 2013-06-11 Wiring board and method of manufacturing the same
KR1020130067810A KR101975302B1 (ko) 2012-06-15 2013-06-13 배선 기판 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012136118A JP6029342B2 (ja) 2012-06-15 2012-06-15 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014003087A JP2014003087A (ja) 2014-01-09
JP2014003087A5 true JP2014003087A5 (enExample) 2015-07-23
JP6029342B2 JP6029342B2 (ja) 2016-11-24

Family

ID=49754848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012136118A Active JP6029342B2 (ja) 2012-06-15 2012-06-15 配線基板及びその製造方法

Country Status (3)

Country Link
US (1) US9161453B2 (enExample)
JP (1) JP6029342B2 (enExample)
KR (1) KR101975302B1 (enExample)

Families Citing this family (29)

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Publication number Priority date Publication date Assignee Title
JP2014027020A (ja) * 2012-07-24 2014-02-06 Toshiba Corp 回路基板、電子機器、および回路基板の製造方法
KR101472639B1 (ko) * 2012-12-31 2014-12-15 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
KR102080663B1 (ko) * 2013-07-15 2020-02-24 삼성전기주식회사 전자소자 내장형 인쇄회로기판 및 그 제조방법
JP6334962B2 (ja) * 2014-03-05 2018-05-30 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
JP6373605B2 (ja) * 2014-03-05 2018-08-15 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
KR20150144587A (ko) * 2014-06-17 2015-12-28 삼성전기주식회사 전자소자 내장기판 및 그 제조 방법
CN106576433B (zh) * 2014-07-25 2020-01-14 Lg 伊诺特有限公司 印刷电路板
TWI611523B (zh) * 2014-09-05 2018-01-11 矽品精密工業股份有限公司 半導體封裝件之製法
KR101609264B1 (ko) * 2014-12-09 2016-04-05 삼성전기주식회사 전자소자 내장 기판 및 그 제조 방법
KR102356810B1 (ko) * 2015-01-22 2022-01-28 삼성전기주식회사 전자부품내장형 인쇄회로기판 및 그 제조방법
JP6442123B2 (ja) * 2015-02-16 2018-12-19 日本特殊陶業株式会社 セラミック配線基板の製造方法
CN106783795A (zh) * 2015-11-20 2017-05-31 恒劲科技股份有限公司 封装基板
US10512174B2 (en) * 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
US20250079324A1 (en) * 2023-08-30 2025-03-06 Absolics Inc. Method of manufacturing packaging substrate and packaging substrate manufactured thereby
CN117939775A (zh) * 2024-02-21 2024-04-26 奥特斯奥地利科技与系统技术有限公司 部件承载件以及制造部件承载件的方法

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JPS54140972A (en) * 1978-04-25 1979-11-01 Matsushita Electric Industrial Co Ltd Printed circuit board and method of producing same
JPS5661191A (en) * 1979-10-24 1981-05-26 Alps Electric Co Ltd Electric part mounting board
JP2001298273A (ja) * 2000-04-17 2001-10-26 Hitachi Ltd 電子部品内蔵実装基板及びそれを用いた半導体パッケージ
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
US7542301B1 (en) * 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
US7876577B2 (en) * 2007-03-12 2011-01-25 Tyco Electronics Corporation System for attaching electronic components to molded interconnection devices
JP5074089B2 (ja) * 2007-04-27 2012-11-14 株式会社Ｊｖｃケンウッド 電子部品収容基板及びその製造方法
JP4988629B2 (ja) * 2008-03-12 2012-08-01 日立オートモティブシステムズ株式会社 電子機器および車載モジュール
JP5153417B2 (ja) * 2008-04-01 2013-02-27 京セラ株式会社 部品内蔵基板および実装構造体
US8261435B2 (en) * 2008-12-29 2012-09-11 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
US8925192B2 (en) * 2009-06-09 2015-01-06 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP5001395B2 (ja) 2010-03-31 2012-08-15 イビデン株式会社 配線板及び配線板の製造方法
US8610001B2 (en) * 2010-05-21 2013-12-17 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
US9049808B2 (en) * 2010-08-21 2015-06-02 Ibiden Co., Ltd. Printed wiring board and a method of manufacturing a printed wiring board

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