JP2013120771A5 - - Google Patents

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Publication number
JP2013120771A5
JP2013120771A5 JP2011266721A JP2011266721A JP2013120771A5 JP 2013120771 A5 JP2013120771 A5 JP 2013120771A5 JP 2011266721 A JP2011266721 A JP 2011266721A JP 2011266721 A JP2011266721 A JP 2011266721A JP 2013120771 A5 JP2013120771 A5 JP 2013120771A5
Authority
JP
Japan
Prior art keywords
metal layer
wiring board
layer
substrate
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011266721A
Other languages
English (en)
Japanese (ja)
Other versions
JP5902931B2 (ja
JP2013120771A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011266721A priority Critical patent/JP5902931B2/ja
Priority claimed from JP2011266721A external-priority patent/JP5902931B2/ja
Priority to US13/691,931 priority patent/US20130143062A1/en
Priority to TW101145579A priority patent/TWI598221B/zh
Priority to KR1020120140519A priority patent/KR101988923B1/ko
Publication of JP2013120771A publication Critical patent/JP2013120771A/ja
Publication of JP2013120771A5 publication Critical patent/JP2013120771A5/ja
Application granted granted Critical
Publication of JP5902931B2 publication Critical patent/JP5902931B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011266721A 2011-12-06 2011-12-06 配線基板の製造方法、及び、配線基板製造用の支持体 Active JP5902931B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011266721A JP5902931B2 (ja) 2011-12-06 2011-12-06 配線基板の製造方法、及び、配線基板製造用の支持体
US13/691,931 US20130143062A1 (en) 2011-12-06 2012-12-03 Method and support member for manufacturing wiring substrate, and structure member for wiring substrate
TW101145579A TWI598221B (zh) 2011-12-06 2012-12-05 配線基板之製造方法及支持件
KR1020120140519A KR101988923B1 (ko) 2011-12-06 2012-12-05 배선 기판 제조 방법, 배선 기판 제조용 지지체 및 배선 기판용 구조체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011266721A JP5902931B2 (ja) 2011-12-06 2011-12-06 配線基板の製造方法、及び、配線基板製造用の支持体

Publications (3)

Publication Number Publication Date
JP2013120771A JP2013120771A (ja) 2013-06-17
JP2013120771A5 true JP2013120771A5 (enExample) 2014-10-16
JP5902931B2 JP5902931B2 (ja) 2016-04-13

Family

ID=48524232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011266721A Active JP5902931B2 (ja) 2011-12-06 2011-12-06 配線基板の製造方法、及び、配線基板製造用の支持体

Country Status (4)

Country Link
US (1) US20130143062A1 (enExample)
JP (1) JP5902931B2 (enExample)
KR (1) KR101988923B1 (enExample)
TW (1) TWI598221B (enExample)

Families Citing this family (20)

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JP6063183B2 (ja) * 2012-08-31 2017-01-18 パナソニックＩｐマネジメント株式会社 剥離可能銅箔付き基板及び回路基板の製造方法
KR101448529B1 (ko) * 2013-06-17 2014-10-08 주식회사 심텍 프라이머층을 이용하는 세미어디티브법을 적용하는 인쇄회로기판의 제조 방법
TWI555166B (zh) * 2013-06-18 2016-10-21 矽品精密工業股份有限公司 層疊式封裝件及其製法
JP6266965B2 (ja) * 2013-12-04 2018-01-24 Ｊｘ金属株式会社 多層プリント配線基板の製造方法及びベース基材
US9554468B2 (en) * 2013-12-19 2017-01-24 Intel Corporation Panel with releasable core
US9554472B2 (en) * 2013-12-19 2017-01-24 Intel Corporation Panel with releasable core
US9522514B2 (en) 2013-12-19 2016-12-20 Intel Corporation Substrate or panel with releasable core
US9434135B2 (en) 2013-12-19 2016-09-06 Intel Corporation Panel with releasable core
JP2015144150A (ja) * 2014-01-31 2015-08-06 京セラサーキットソリューションズ株式会社 配線基板の製造方法
CN105931997B (zh) * 2015-02-27 2019-02-05 胡迪群 暂时性复合式载板
WO2016143117A1 (ja) * 2015-03-12 2016-09-15 三井金属鉱業株式会社 キャリア付き金属箔及び配線基板の製造方法
TWI571994B (zh) * 2015-06-30 2017-02-21 旭德科技股份有限公司 封裝基板及其製作方法
CN106550542B (zh) * 2015-09-17 2021-10-26 奥特斯(中国)有限公司 插入保护结构并且靠近保护结构具有纯介质层的部件载体
US9899239B2 (en) * 2015-11-06 2018-02-20 Apple Inc. Carrier ultra thin substrate
KR101932326B1 (ko) * 2016-12-20 2018-12-24 주식회사 두산 인쇄회로기판 및 이의 제조방법
KR102179165B1 (ko) 2017-11-28 2020-11-16 삼성전자주식회사 캐리어 기판 및 상기 캐리어 기판을 이용한 반도체 패키지의 제조방법
US11990349B2 (en) * 2018-12-14 2024-05-21 Mitsubishi Gas Chemical Company, Inc. Method for producing package substrate for loading semiconductor device
US12173128B2 (en) * 2019-04-16 2024-12-24 Nippon Steel Corporation Metal-fiber reinforced plastic composite
JP7528578B2 (ja) * 2020-07-09 2024-08-06 Ｔｏｐｐａｎホールディングス株式会社 支持体付き基板ユニット、基板ユニット、半導体装置、および、支持体付き基板ユニットの製造方法
CN113066767B (zh) * 2021-03-05 2022-01-25 南通越亚半导体有限公司 临时承载板及其制作方法和封装基板的制造方法

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JPS5517507B2 (enExample) * 1972-06-29 1980-05-12
US6270889B1 (en) * 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6355360B1 (en) * 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6565954B2 (en) * 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
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US6459046B1 (en) * 2000-08-28 2002-10-01 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method for producing the same
US6955740B2 (en) * 2002-01-10 2005-10-18 Polyclad Laminates, Inc. Production of laminates for printed wiring boards using protective carrier
EP1357773A3 (en) * 2002-04-25 2005-11-30 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
TW200420208A (en) * 2002-10-31 2004-10-01 Furukawa Circuit Foil Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP2006049660A (ja) * 2004-08-06 2006-02-16 Cmk Corp プリント配線板の製造方法
JP4334005B2 (ja) * 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
JP5092662B2 (ja) * 2007-10-03 2012-12-05 凸版印刷株式会社 印刷配線板の製造方法
KR101025520B1 (ko) * 2008-11-26 2011-04-04 삼성전기주식회사 다층 인쇄회로기판 제조방법
KR101055495B1 (ko) * 2009-04-14 2011-08-08 삼성전기주식회사 기판 제조용 캐리어 부재 및 이를 이용한 기판 제조방법

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