JP2015518270A5 - - Google Patents

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Publication number
JP2015518270A5
JP2015518270A5 JP2015501697A JP2015501697A JP2015518270A5 JP 2015518270 A5 JP2015518270 A5 JP 2015518270A5 JP 2015501697 A JP2015501697 A JP 2015501697A JP 2015501697 A JP2015501697 A JP 2015501697A JP 2015518270 A5 JP2015518270 A5 JP 2015518270A5
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JP
Japan
Prior art keywords
layer
substrate
support
release layer
laminate
Prior art date
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Granted
Application number
JP2015501697A
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English (en)
Japanese (ja)
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JP6268158B2 (ja
JP2015518270A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/029314 external-priority patent/WO2013142054A1/en
Publication of JP2015518270A publication Critical patent/JP2015518270A/ja
Publication of JP2015518270A5 publication Critical patent/JP2015518270A5/ja
Application granted granted Critical
Publication of JP6268158B2 publication Critical patent/JP6268158B2/ja
Active legal-status Critical Current
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JP2015501697A 2012-03-20 2013-03-06 一時的基板支持体及び支持体分離のための積層体、方法、並びに材料 Active JP6268158B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261613062P 2012-03-20 2012-03-20
US61/613,062 2012-03-20
PCT/US2013/029314 WO2013142054A1 (en) 2012-03-20 2013-03-06 Laminate body, method, and materials for temporary substrate support and support separation

Publications (3)

Publication Number Publication Date
JP2015518270A JP2015518270A (ja) 2015-06-25
JP2015518270A5 true JP2015518270A5 (enExample) 2016-03-31
JP6268158B2 JP6268158B2 (ja) 2018-01-24

Family

ID=49223167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015501697A Active JP6268158B2 (ja) 2012-03-20 2013-03-06 一時的基板支持体及び支持体分離のための積層体、方法、並びに材料

Country Status (6)

Country Link
US (1) US20150034238A1 (enExample)
EP (1) EP2828883B1 (enExample)
JP (1) JP6268158B2 (enExample)
KR (1) KR102063559B1 (enExample)
TW (1) TW201345729A (enExample)
WO (1) WO2013142054A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2810300A4 (en) * 2012-01-30 2016-05-11 3M Innovative Properties Co DEVICE, HYBRID LAMINATED BODY, METHOD AND MATERIALS FOR TEMPORARY SUBSTRATE CARRIER
US9269623B2 (en) 2012-10-25 2016-02-23 Rohm And Haas Electronic Materials Llc Ephemeral bonding
US9315696B2 (en) * 2013-10-31 2016-04-19 Dow Global Technologies Llc Ephemeral bonding
JP6299290B2 (ja) * 2014-03-07 2018-03-28 富士通株式会社 回路基板の製造方法
JP6193813B2 (ja) * 2014-06-10 2017-09-06 信越化学工業株式会社 ウエハ加工用仮接着材料、ウエハ加工体及びこれらを使用する薄型ウエハの製造方法
TWI692517B (zh) 2015-09-30 2020-05-01 日商富士軟片股份有限公司 暫時接著劑、積層體、積層體的製造方法、元件基板的製造方法及半導體元件的製造方法
JP6935807B2 (ja) * 2017-02-02 2021-09-15 昭和電工マテリアルズ株式会社 電子部品の製造方法、仮保護用樹脂組成物及び仮保護用樹脂フィルム
CN111051256A (zh) * 2017-07-31 2020-04-21 康宁股份有限公司 具有非玻璃芯体和玻璃包封物的层压制品及其方法
WO2019049588A1 (en) 2017-09-07 2019-03-14 Mapper Lithography Ip B.V. METHODS AND SYSTEMS FOR COATING A SUBSTRATE
CN111465493A (zh) * 2017-12-12 2020-07-28 3M创新有限公司 复合膜、电子器件的护盖及其制备方法
KR102455146B1 (ko) * 2020-02-10 2022-10-17 주식회사 나노인 기판의 구조충진을 위한 가역적 코팅 방법 및 봉지 방법
JP2021168365A (ja) * 2020-04-13 2021-10-21 株式会社ディスコ 板状物の加工方法

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US4348454A (en) * 1981-03-02 1982-09-07 General Electric Company Ultraviolet light curable acrylic functional silicone compositions
DE3850451T2 (de) * 1987-07-08 1995-03-09 Furukawa Electric Co Ltd Strahlungsvernetzbare Klebestreifen.
JP2661950B2 (ja) * 1988-03-31 1997-10-08 古河電気工業株式会社 半導体ウエハ固定用放射線硬化性粘着テープ
WO1992016590A1 (en) * 1991-03-20 1992-10-01 Minnesota Mining And Manufacturing Company Radiation curable vinyl/silicone release coating
JP3325650B2 (ja) 1993-04-15 2002-09-17 株式会社ディスコ ウェーハの研磨方法
JPH11283279A (ja) 1998-01-30 1999-10-15 Minnesota Mining & Mfg Co <3M> 貼り合わせ型光ディスク並びにその製造方法及び装置
US6966610B2 (en) * 2000-02-22 2005-11-22 Minova International Limited Treatment of rock surfaces
US6420480B1 (en) * 2000-05-05 2002-07-16 3M Innovative Properties Company Waterborne silicone acrylate latex polymers for release
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
JP4565804B2 (ja) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
JP2004253483A (ja) * 2003-02-18 2004-09-09 Dainippon Printing Co Ltd 半導体ウエハの製造方法
JP2004300231A (ja) * 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
US7226812B2 (en) * 2004-03-31 2007-06-05 Intel Corporation Wafer support and release in wafer processing
US20080014532A1 (en) * 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
US7514797B2 (en) * 2007-05-31 2009-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-die wafer level packaging
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KR101027858B1 (ko) * 2009-01-13 2011-04-07 도레이첨단소재 주식회사 반도체 박막 웨이퍼 가공용 웨이퍼 서포트 점착필름
CN102114737A (zh) * 2009-12-31 2011-07-06 鸿富锦精密工业（深圳）有限公司 转印膜及转印膜的制造方法
JP2011238815A (ja) * 2010-05-12 2011-11-24 Shin Etsu Polymer Co Ltd 粘着シート及び半導体ウェーハの取り扱い方法
TW201207070A (en) * 2010-07-05 2012-02-16 Nitto Denko Corp Active energy ray-curable pressure-sensitive adhesive for re-release and dicing die-bonding film
US9263314B2 (en) * 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling

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