JP2013042180A5 - - Google Patents
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- Publication number
- JP2013042180A5 JP2013042180A5 JP2012254358A JP2012254358A JP2013042180A5 JP 2013042180 A5 JP2013042180 A5 JP 2013042180A5 JP 2012254358 A JP2012254358 A JP 2012254358A JP 2012254358 A JP2012254358 A JP 2012254358A JP 2013042180 A5 JP2013042180 A5 JP 2013042180A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- forming
- thin film
- insulating
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 claims 23
- 239000010409 thin film Substances 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 10
- 230000001678 irradiating effect Effects 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012254358A JP5634487B2 (ja) | 2005-06-01 | 2012-11-20 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005161413 | 2005-06-01 | ||
| JP2005161413 | 2005-06-01 | ||
| JP2012254358A JP5634487B2 (ja) | 2005-06-01 | 2012-11-20 | 半導体装置の作製方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006150476A Division JP5210501B2 (ja) | 2005-06-01 | 2006-05-30 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013042180A JP2013042180A (ja) | 2013-02-28 |
| JP2013042180A5 true JP2013042180A5 (enExample) | 2014-02-20 |
| JP5634487B2 JP5634487B2 (ja) | 2014-12-03 |
Family
ID=37494669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012254358A Expired - Fee Related JP5634487B2 (ja) | 2005-06-01 | 2012-11-20 | 半導体装置の作製方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (4) | US7485511B2 (enExample) |
| JP (1) | JP5634487B2 (enExample) |
| CN (1) | CN100539086C (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7863188B2 (en) | 2005-07-29 | 2011-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US7968382B2 (en) | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| JP4380718B2 (ja) | 2007-03-15 | 2009-12-09 | ソニー株式会社 | 半導体装置の製造方法 |
| US7973316B2 (en) * | 2007-03-26 | 2011-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US8149080B2 (en) * | 2007-09-25 | 2012-04-03 | Infineon Technologies Ag | Integrated circuit including inductive device and ferromagnetic material |
| US7868362B2 (en) * | 2007-10-16 | 2011-01-11 | Honeywell International Inc. | SOI on package hypersensitive sensor |
| WO2009104371A1 (ja) * | 2008-02-20 | 2009-08-27 | シャープ株式会社 | フレキシブル半導体基板の製造方法 |
| WO2010035627A1 (en) | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2011003522A (ja) | 2008-10-16 | 2011-01-06 | Semiconductor Energy Lab Co Ltd | フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法 |
| KR101243920B1 (ko) * | 2010-01-07 | 2013-03-14 | 삼성디스플레이 주식회사 | 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법 |
| US20110186940A1 (en) * | 2010-02-03 | 2011-08-04 | Honeywell International Inc. | Neutron sensor with thin interconnect stack |
| US8310021B2 (en) | 2010-07-13 | 2012-11-13 | Honeywell International Inc. | Neutron detector with wafer-to-wafer bonding |
| CN109273622B (zh) | 2013-08-06 | 2021-03-12 | 株式会社半导体能源研究所 | 剥离方法 |
| US10978489B2 (en) | 2015-07-24 | 2021-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display panel, method for manufacturing semiconductor device, method for manufacturing display panel, and information processing device |
| WO2017103737A1 (en) | 2015-12-18 | 2017-06-22 | Semiconductor Energy Laboratory Co., Ltd. | Display panel, input/output device, data processing device, and method for manufacturing display panel |
| US10181424B2 (en) | 2016-04-12 | 2019-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Peeling method and manufacturing method of flexible device |
| TWI727041B (zh) | 2016-05-20 | 2021-05-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置 |
| WO2018065861A1 (ja) | 2016-10-07 | 2018-04-12 | 株式会社半導体エネルギー研究所 | ガラス基板の洗浄方法、半導体装置の作製方法、及びガラス基板 |
| CN106585069A (zh) * | 2016-12-23 | 2017-04-26 | 武汉华星光电技术有限公司 | 柔性基板、面板及丝网印刷机制作柔性基板、面板的方法 |
| KR20180083253A (ko) | 2017-01-12 | 2018-07-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| KR20190117789A (ko) * | 2017-05-17 | 2019-10-16 | 가부시키가이샤 노다스크린 | 박막 캐패시터 구조, 및 당해 박막 캐패시터 구조를 구비한 반도체 장치 |
| WO2019175704A1 (ja) | 2018-03-16 | 2019-09-19 | 株式会社半導体エネルギー研究所 | 電気モジュール、表示パネル、表示装置、入出力装置、情報処理装置、電気モジュールの作製方法 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2601500B1 (fr) * | 1986-07-11 | 1988-10-21 | Bull Sa | Procede de liaison programmable par laser de deux conducteurs superposes du reseau d'interconnexion d'un circuit integre, et circuit integre en resultant |
| JPH03232232A (ja) | 1990-02-08 | 1991-10-16 | Fujitsu Ltd | 半導体装置の製造方法 |
| US5317436A (en) | 1990-12-31 | 1994-05-31 | Kopin Corporation | A slide assembly for projector with active matrix moveably mounted to housing |
| US5166556A (en) | 1991-01-22 | 1992-11-24 | Myson Technology, Inc. | Programmable antifuse structure, process, logic cell and architecture for programmable integrated circuits |
| US6720576B1 (en) | 1992-09-11 | 2004-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Plasma processing method and photoelectric conversion device |
| US5821597A (en) | 1992-09-11 | 1998-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device |
| JP3770631B2 (ja) | 1994-10-24 | 2006-04-26 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP3579492B2 (ja) | 1995-03-16 | 2004-10-20 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| US5757456A (en) | 1995-03-10 | 1998-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating involving peeling circuits from one substrate and mounting on other |
| US6022792A (en) | 1996-03-13 | 2000-02-08 | Seiko Instruments, Inc. | Semiconductor dicing and assembling method |
| US6011275A (en) * | 1996-12-30 | 2000-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| CN102254865A (zh) | 1999-02-24 | 2011-11-23 | 日立马库塞鲁株式会社 | 集成电路元件的制造方法 |
| JP4748859B2 (ja) | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| US7060153B2 (en) | 2000-01-17 | 2006-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of manufacturing the same |
| US20010053559A1 (en) | 2000-01-25 | 2001-12-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating display device |
| TW507258B (en) | 2000-02-29 | 2002-10-21 | Semiconductor Systems Corp | Display device and method for fabricating the same |
| JP2001318624A (ja) | 2000-02-29 | 2001-11-16 | Semiconductor Energy Lab Co Ltd | 表示装置およびその作製方法 |
| JP2001345452A (ja) | 2000-06-02 | 2001-12-14 | Nec Kagoshima Ltd | 薄膜トランジスタ及びその製造方法 |
| SG143972A1 (en) | 2000-09-14 | 2008-07-29 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| JP4939690B2 (ja) * | 2001-01-30 | 2012-05-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6814832B2 (en) * | 2001-07-24 | 2004-11-09 | Seiko Epson Corporation | Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance |
| EP2565924B1 (en) | 2001-07-24 | 2018-01-10 | Samsung Electronics Co., Ltd. | Transfer method |
| JP3956697B2 (ja) | 2001-12-28 | 2007-08-08 | セイコーエプソン株式会社 | 半導体集積回路の製造方法 |
| JP2004179649A (ja) * | 2002-11-12 | 2004-06-24 | Sony Corp | 超薄型半導体装置の製造方法および製造装置 |
| JP4554152B2 (ja) * | 2002-12-19 | 2010-09-29 | 株式会社半導体エネルギー研究所 | 半導体チップの作製方法 |
| JP4393859B2 (ja) | 2002-12-27 | 2010-01-06 | 株式会社半導体エネルギー研究所 | 記録媒体の作製方法 |
| EP1437683B1 (en) | 2002-12-27 | 2017-03-08 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking account system using the IC card |
| JP4524992B2 (ja) * | 2003-01-28 | 2010-08-18 | セイコーエプソン株式会社 | 薄膜トランジスタ型表示装置、薄膜素子の製造方法、薄膜トランジスタ回路基板、電気光学装置および電子機器 |
| JP2004247373A (ja) * | 2003-02-12 | 2004-09-02 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2004349543A (ja) | 2003-05-23 | 2004-12-09 | Seiko Epson Corp | 積層体の剥離方法、薄膜装置の製造法、薄膜装置、電子機器 |
| JP2005056985A (ja) | 2003-08-01 | 2005-03-03 | Seiko Epson Corp | 半導体装置の製造方法、半導体装置および電子機器 |
| US7492090B2 (en) | 2003-09-19 | 2009-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| JP4574295B2 (ja) | 2003-09-19 | 2010-11-04 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| WO2005057658A1 (en) | 2003-12-15 | 2005-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device |
| US7271076B2 (en) | 2003-12-19 | 2007-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
| US7699232B2 (en) * | 2004-02-06 | 2010-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2006011665A1 (en) * | 2004-07-30 | 2006-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Laminating system, ic sheet, scroll of ic sheet, and method for manufacturing ic chip |
| KR101203090B1 (ko) * | 2004-07-30 | 2012-11-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| US7422935B2 (en) | 2004-09-24 | 2008-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device, and semiconductor device and electronic device |
| KR101176027B1 (ko) * | 2004-10-19 | 2012-08-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 안테나를 구비한 반도체장치 및 그 제조 방법 |
| US7364954B2 (en) * | 2005-04-28 | 2008-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
-
2006
- 2006-05-25 US US11/440,128 patent/US7485511B2/en not_active Expired - Fee Related
- 2006-06-01 CN CNB2006101060325A patent/CN100539086C/zh not_active Expired - Fee Related
-
2008
- 2008-12-23 US US12/342,446 patent/US7816685B2/en not_active Expired - Fee Related
-
2010
- 2010-10-12 US US12/902,642 patent/US8120034B2/en not_active Expired - Fee Related
-
2011
- 2011-12-01 US US13/308,582 patent/US8362485B2/en active Active
-
2012
- 2012-11-20 JP JP2012254358A patent/JP5634487B2/ja not_active Expired - Fee Related
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