JP2014063801A5 - - Google Patents

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Publication number
JP2014063801A5
JP2014063801A5 JP2012206743A JP2012206743A JP2014063801A5 JP 2014063801 A5 JP2014063801 A5 JP 2014063801A5 JP 2012206743 A JP2012206743 A JP 2012206743A JP 2012206743 A JP2012206743 A JP 2012206743A JP 2014063801 A5 JP2014063801 A5 JP 2014063801A5
Authority
JP
Japan
Prior art keywords
insulating layer
wiring
layer
via hole
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012206743A
Other languages
English (en)
Japanese (ja)
Other versions
JP6057641B2 (ja
JP2014063801A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012206743A priority Critical patent/JP6057641B2/ja
Priority claimed from JP2012206743A external-priority patent/JP6057641B2/ja
Priority to US14/021,110 priority patent/US9137896B2/en
Publication of JP2014063801A publication Critical patent/JP2014063801A/ja
Publication of JP2014063801A5 publication Critical patent/JP2014063801A5/ja
Application granted granted Critical
Publication of JP6057641B2 publication Critical patent/JP6057641B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012206743A 2012-09-20 2012-09-20 配線基板及びその製造方法 Active JP6057641B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012206743A JP6057641B2 (ja) 2012-09-20 2012-09-20 配線基板及びその製造方法
US14/021,110 US9137896B2 (en) 2012-09-20 2013-09-09 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012206743A JP6057641B2 (ja) 2012-09-20 2012-09-20 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014063801A JP2014063801A (ja) 2014-04-10
JP2014063801A5 true JP2014063801A5 (enExample) 2015-10-01
JP6057641B2 JP6057641B2 (ja) 2017-01-11

Family

ID=50273291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012206743A Active JP6057641B2 (ja) 2012-09-20 2012-09-20 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US9137896B2 (enExample)
JP (1) JP6057641B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9087777B2 (en) * 2013-03-14 2015-07-21 United Test And Assembly Center Ltd. Semiconductor packages and methods of packaging semiconductor devices
JP6075789B2 (ja) * 2014-01-31 2017-02-08 京セラ株式会社 配線基板の製造方法
JP6550260B2 (ja) * 2015-04-28 2019-07-24 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP7063101B2 (ja) * 2018-05-11 2022-05-09 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
JP7715590B2 (ja) 2021-09-27 2025-07-30 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP7715010B2 (ja) * 2021-11-02 2025-07-30 新光電気工業株式会社 配線基板及びその製造方法、半導体装置
KR20230097817A (ko) * 2021-12-24 2023-07-03 삼성전기주식회사 인쇄회로기판, 캐리어 부착 인쇄회로기판 및 인쇄회로기판 패키지의 제조방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
EP0620703B1 (en) * 1993-04-12 1997-12-29 Ibiden Co, Ltd. Resin compositions and printed circuit boards using the same
JP4012307B2 (ja) 1998-04-02 2007-11-21 イビデン株式会社 多層プリント配線板の製造方法
JP3527694B2 (ja) * 2000-08-11 2004-05-17 新光電気工業株式会社 配線基板の製造方法
JP2007073834A (ja) * 2005-09-08 2007-03-22 Shinko Electric Ind Co Ltd 絶縁樹脂層上の配線形成方法
JP5105168B2 (ja) * 2005-11-02 2012-12-19 イビデン株式会社 多層プリント配線板
US7722950B2 (en) * 2005-11-14 2010-05-25 World Properties, Inc. Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP4895795B2 (ja) 2006-12-20 2012-03-14 新光電気工業株式会社 多層配線基板の製造方法
JP5092547B2 (ja) * 2007-05-30 2012-12-05 凸版印刷株式会社 印刷配線板の製造方法
JP5092662B2 (ja) 2007-10-03 2012-12-05 凸版印刷株式会社 印刷配線板の製造方法
WO2009126366A2 (en) * 2008-04-10 2009-10-15 World Properties, Inc. Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
JP5322531B2 (ja) * 2008-05-27 2013-10-23 新光電気工業株式会社 配線基板の製造方法
JP5251464B2 (ja) * 2008-12-03 2013-07-31 日立化成株式会社 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法

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