JP6057641B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP6057641B2
JP6057641B2 JP2012206743A JP2012206743A JP6057641B2 JP 6057641 B2 JP6057641 B2 JP 6057641B2 JP 2012206743 A JP2012206743 A JP 2012206743A JP 2012206743 A JP2012206743 A JP 2012206743A JP 6057641 B2 JP6057641 B2 JP 6057641B2
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JP
Japan
Prior art keywords
layer
insulating layer
wiring
via hole
resin layer
Prior art date
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Active
Application number
JP2012206743A
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English (en)
Japanese (ja)
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JP2014063801A5 (enExample
JP2014063801A (ja
Inventor
小林　和弘
和弘 小林
幸太郎 小谷
幸太郎 小谷
中村　順一
順一 中村
金子　健太郎
健太郎 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012206743A priority Critical patent/JP6057641B2/ja
Priority to US14/021,110 priority patent/US9137896B2/en
Publication of JP2014063801A publication Critical patent/JP2014063801A/ja
Publication of JP2014063801A5 publication Critical patent/JP2014063801A5/ja
Application granted granted Critical
Publication of JP6057641B2 publication Critical patent/JP6057641B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2012206743A 2012-09-20 2012-09-20 配線基板及びその製造方法 Active JP6057641B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012206743A JP6057641B2 (ja) 2012-09-20 2012-09-20 配線基板及びその製造方法
US14/021,110 US9137896B2 (en) 2012-09-20 2013-09-09 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012206743A JP6057641B2 (ja) 2012-09-20 2012-09-20 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014063801A JP2014063801A (ja) 2014-04-10
JP2014063801A5 JP2014063801A5 (enExample) 2015-10-01
JP6057641B2 true JP6057641B2 (ja) 2017-01-11

Family

ID=50273291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012206743A Active JP6057641B2 (ja) 2012-09-20 2012-09-20 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US9137896B2 (enExample)
JP (1) JP6057641B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9087777B2 (en) * 2013-03-14 2015-07-21 United Test And Assembly Center Ltd. Semiconductor packages and methods of packaging semiconductor devices
JP6075789B2 (ja) * 2014-01-31 2017-02-08 京セラ株式会社 配線基板の製造方法
JP6550260B2 (ja) * 2015-04-28 2019-07-24 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP7063101B2 (ja) * 2018-05-11 2022-05-09 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
JP7715590B2 (ja) 2021-09-27 2025-07-30 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP7715010B2 (ja) * 2021-11-02 2025-07-30 新光電気工業株式会社 配線基板及びその製造方法、半導体装置
KR20230097817A (ko) * 2021-12-24 2023-07-03 삼성전기주식회사 인쇄회로기판, 캐리어 부착 인쇄회로기판 및 인쇄회로기판 패키지의 제조방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
EP0620703B1 (en) * 1993-04-12 1997-12-29 Ibiden Co, Ltd. Resin compositions and printed circuit boards using the same
JP4012307B2 (ja) 1998-04-02 2007-11-21 イビデン株式会社 多層プリント配線板の製造方法
JP3527694B2 (ja) * 2000-08-11 2004-05-17 新光電気工業株式会社 配線基板の製造方法
JP2007073834A (ja) * 2005-09-08 2007-03-22 Shinko Electric Ind Co Ltd 絶縁樹脂層上の配線形成方法
JP5105168B2 (ja) * 2005-11-02 2012-12-19 イビデン株式会社 多層プリント配線板
US7722950B2 (en) * 2005-11-14 2010-05-25 World Properties, Inc. Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP4895795B2 (ja) 2006-12-20 2012-03-14 新光電気工業株式会社 多層配線基板の製造方法
JP5092547B2 (ja) * 2007-05-30 2012-12-05 凸版印刷株式会社 印刷配線板の製造方法
JP5092662B2 (ja) 2007-10-03 2012-12-05 凸版印刷株式会社 印刷配線板の製造方法
WO2009126366A2 (en) * 2008-04-10 2009-10-15 World Properties, Inc. Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
JP5322531B2 (ja) * 2008-05-27 2013-10-23 新光電気工業株式会社 配線基板の製造方法
JP5251464B2 (ja) * 2008-12-03 2013-07-31 日立化成株式会社 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法

Also Published As

Publication number Publication date
US9137896B2 (en) 2015-09-15
US20140076614A1 (en) 2014-03-20
JP2014063801A (ja) 2014-04-10

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